Inventor · disambiguated record
Joseph Alphonse Kotylo
Also filed as: CANGELOSI JOAN · KOTYLO JOSEPH A · KOTYLO JOSEPH ALPHONSE
10 granted patents·276 citations·filing 1991–2004
91Inventor score
Top patents by PatentIndex Score
10 records- 0194US5268260APhotoresist develop and strip solvent compositions and method for their useIBM·Filed 1991·Granted Dec 7, 1993·102 cites·3 claims
- 0276US6009620AMethod of making a printed circuit board having filled holesIBM·Filed 1998·Granted Jan 4, 2000·41 cites·34 claims
- 0375US7087441B2Method of making a circuitized substrate having a plurality of solder connection sites thereonENDICOTT INTERCONNECT TECH INC·Filed 2004·Granted Aug 8, 2006·20 cites·52 claims
- 0475US6586683B2Printed circuit board with mixed metallurgy pads and method of fabricationIBM·Filed 2001·Granted Jul 1, 2003·15 cites·15 claims
- 0570US6127097APhotoresist develop and strip solvent compositions and method for their useIBM·Filed 1997·Granted Oct 3, 2000·27 cites·5 claims
- 0670US5869356AMethod and structure for constraining the flow of incapsulant applied to an I/C chip on a substrateIBM·Filed 1998·Granted Feb 9, 1999·35 cites·10 claims
- 0765US6908684B2Promoting adhesion between a polymer and a metallic substrateIBM·Filed 2004·Granted Jun 21, 2005·3 cites·10 claims
- 0861US5784260AStructure for constraining the flow of encapsulant applied to an I/C chip on a substrateIBM·Filed 1996·Granted Jul 21, 1998·24 cites·6 claims
- 0960US6931722B2Method of fabricating printed circuit board with mixed metallurgy padsIBM·Filed 2003·Granted Aug 23, 2005·7 cites·19 claims
- 1032US6730409B1Promoting adhesion between a polymer and a metallic substrateIBM·Filed 1999·Granted May 4, 2004·2 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →