Inventor · disambiguated record
Jum-Gon Kim
Also filed as: KIM JUM-GON
3 granted patents·4 citations·filing 2009–2013
58Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0162US8735281B2Inter connection structure including copper pad and pad barrier layer, semiconductor device and electronic apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted May 27, 2014·1 cites·20 claims
- 0257US8456012B2Inter connection structure including copper pad and pad barrier layer, semiconductor device and electronic apparatus including the sameSHIN CHANG-WOO·Filed 2009·Granted Jun 4, 2013·2 cites·19 claims
- 0355US7969024B2Semiconductor package with joint reliability, entangled wires including insulating materialSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Jun 28, 2011·1 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →