Inventor · disambiguated record
Jian-Wen Lo
Also filed as: LO JIAN W · LO JIAN-WEN
8 granted patents·6 pending applications·155 citations·filing 2004–2010
88Inventor score
Technology areasH10W
Top patents by PatentIndex Score
14 records- 0195US7741152B2Three-dimensional package and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Jun 22, 2010·44 cites·11 claims
- 0294US7528053B2Three-dimensional package and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted May 5, 2009·31 cites·22 claims
- 0393US7642132B2Three-dimensional package and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Jan 5, 2010·24 cites·20 claims
- 0490US7446404B2Three-dimensional package and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Nov 4, 2008·18 cites·8 claims
- 0589US8552553B2Semiconductor deviceLO JIAN-WEN·Filed 2010·Granted Oct 8, 2013·16 cites·20 claims
- 0686US8334594B2Chip having a metal pillar structureLO JIAN-WEN·Filed 2010·Granted Dec 18, 2012·12 cites·20 claims
- 0778US8288853B2Three-dimensional package and method of making the sameHUANG MIN-LUNG·Filed 2009·Granted Oct 16, 2012·9 cites·10 claims
- 0844US7151317B2Multi-chip package structureADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Dec 19, 2006·1 cites·16 claims
- 0941US2007111499A1Wafer redistribution structure with metallic pillar and method for fabricating the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
- 1041US2007102829A1Chip structure with solder bump and method for producing the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
- 1138US2006134884A1Wafer structure, chip structure, and fabricating process thereofADVANCED SEMICONDUCTOR ENG·Filed 2005·Application pending·0 cites
- 1238US2005095750A1Wafer level transparent packagingADVANCED SEMICONDUCTOR ENG·Filed 2004·Application pending·0 cites
- 1331US2006199306A1Chip structure and manufacturing process thereofTSAI MON-CHIN·Filed 2005·Application pending·0 cites
- 1431US2006197191A1Chip structure and wafer structureTSAI MON-CHIN·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →