Inventor · disambiguated record
Rebecca G. Cole
Also filed as: COLE REBECCA G
2 granted patents·1 pending application·187 citations·filing 1999–2002
70Inventor score
Technology areasH10W
Files withMOTOROLA INC2
Top patents by PatentIndex Score
3 records- 0195US6713381B2Method of forming semiconductor device including interconnect barrier layersMOTOROLA INC·Filed 2002·Granted Mar 30, 2004·135 cites·13 claims
- 0285US6429531B1Method and apparatus for manufacturing an interconnect structureMOTOROLA INC·Filed 2000·Granted Aug 6, 2002·52 cites·11 claims
- 0327US2002000665A1Semiconductor device conductive bump and interconnect barrierFiled 1999·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →