Inventor · disambiguated record
Robert J. Wenzel
Also filed as: WENZEL ROBERT · WENZEL ROBERT J · WENZEL ROBERT JOSEPH
31 granted patents·4 pending applications·1,519 citations·filing 1982–2024
98Inventor score
Files withFREESCALE SEMICONDUCTOR INC15BURGER KING CORP3FRYMASTER CORP3NXP USA INC3BARTLEY MACHINES & MANUFACTURI2
Top patents by PatentIndex Score
35 records- 0198US6921975B2Circuit device with at least partial packaging, exposed active surface and a voltage reference planeFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Jul 26, 2005·233 cites·23 claims
- 0298US6838776B2Circuit device with at least partial packaging and method for formingFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Jan 4, 2005·314 cites·43 claims
- 0397US7405102B2Methods and apparatus for thermal management in a multi-layer embedded chip structureFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Jul 29, 2008·69 cites·12 claims
- 0497US7361987B2Circuit device with at least partial packaging and method for formingFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Apr 22, 2008·75 cites·15 claims
- 0596US6812580B1Semiconductor package having optimized wire bond positioningFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Nov 2, 2004·117 cites·30 claims
- 0696US4455924AOven for cooking and flavoring meat productsALCO STANDARD CORP·Filed 1982·Granted Jun 26, 1984·78 cites·8 claims
- 0795US7763976B2Integrated circuit module with integrated passive deviceFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted Jul 27, 2010·38 cites·19 claims
- 0895US7632715B2Method of packaging semiconductor devicesFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Dec 15, 2009·44 cites·18 claims
- 0994US5841330ASeries coupled filters where the first filter is a dielectric resonator filter with cross-couplingBARTLEY MACHINES & MANUFACTURI·Filed 1995·Granted Nov 24, 1998·116 cites·33 claims
- 1092US7892882B2Methods and apparatus for a semiconductor device package with improved thermal performanceFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Feb 22, 2011·26 cites·10 claims
- 1192US5931083AApparatus and system for conditioning food productsFRYMASTER CORP·Filed 1997·Granted Aug 3, 1999·77 cites·14 claims
- 1290US9974174B1Package to board interconnect structure with built-in reference plane structureFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted May 15, 2018·8 cites·19 claims
- 1390US6239673B1Dielectric resonator filter having reduced spurious modesBARTLEY MACHINES & MFG·Filed 1999·Granted May 29, 2001·59 cites·23 claims
- 1488US7921767B2Automatic broiler for variable batch cookingBURGER KING CORP·Filed 2007·Granted Apr 12, 2011·21 cites·15 claims
- 1584US8033213B2Automatic broiler for variable batch cookingBURGER KING CORP·Filed 2005·Granted Oct 11, 2011·15 cites·11 claims
- 1681US6153244AMethod for conditioning food productsFRYMASTER CORP·Filed 1999·Granted Nov 28, 2000·44 cites·9 claims
- 1778US10256193B1Methods and devices with enhanced grounding and shielding for wire bond structuresNXP USA INC·Filed 2017·Granted Apr 9, 2019·3 cites·18 claims
- 1878US4702827APortable filterFRYMASTER CORP·Filed 1986·Granted Oct 27, 1987·47 cites·11 claims
- 1976US7528069B2Fine pitch interconnect and method of makingFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted May 5, 2009·7 cites·18 claims
- 2076US6094113ADielectric resonator filter having cross-coupled resonatorsBARTLEY MACHINES & MANUFACTURI·Filed 1998·Granted Jul 25, 2000·22 cites·21 claims
- 2176US5847365AInstant-on cooking device controllerGARLAND COMMERCIAL IND INC·Filed 1997·Granted Dec 8, 1998·46 cites·19 claims
- 2269US6171630B1Method and apparatus for generating and applying steam for food cooking and finishingLINCOLN FOODSERVICE·Filed 1999·Granted Jan 9, 2001·38 cites·15 claims
- 2368US8072062B2Circuit device with at least partial packaging and method for formingLEAL GEORGE R·Filed 2008·Granted Dec 6, 2011·3 cites·14 claims
- 2463US7222563B2Steam generating assemblyBURGER KING CORP·Filed 2003·Granted May 29, 2007·16 cites·30 claims
- 2561US2024347928A1Antenna packageNXP BV·Filed 2024·Application pending·0 cites
- 2660US11876059B2Semiconductor device with directing structure and method thereforNXP USA INC·Filed 2021·Granted Jan 16, 2024·0 cites·20 claims
- 2758US8912667B2Packaged integrated circuit using wire bondsWENZEL ROBERT J·Filed 2012·Granted Dec 16, 2014·1 cites·18 claims
- 2856US7674656B2Die positioning for packaged integrated circuitsFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Mar 9, 2010·2 cites·23 claims
- 2955US2024203911A1Interposer with integrative passive componentsNXP USA INC·Filed 2022·Application pending·0 cites
- 3048US7579219B2Semiconductor device with a protected active die region and method thereforFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Aug 25, 2009·0 cites·16 claims
- 3145US7553753B2Method of forming crack arrest features in embedded device build-up package and package thereofFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Jun 30, 2009·0 cites·15 claims
- 3241US2007212813A1Perforated embedded plane package and methodFAY OWEN R·Filed 2006·Application pending·0 cites
- 3340US9748168B2Substrate with routingFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Aug 29, 2017·0 cites·19 claims
- 3440US2005242425A1Semiconductor device with a protected active die region and method thereforLEAL GEORGE R·Filed 2004·Application pending·0 cites
- 3536US7834466B2Semiconductor die with die pad patternFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Nov 16, 2010·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →