Inventor · disambiguated record
Sumio Koiwa
Also filed as: KOIWA SUMIO
10 granted patents·2 pending applications·136 citations·filing 1997–2024
87Inventor score
Top patents by PatentIndex Score
12 records- 0191US6037627AMOS semiconductor deviceSEIKO INSTR INC·Filed 1997·Granted Mar 14, 2000·103 cites·17 claims
- 0290US10256176B2Through-hole electrode substrate and semiconductor device using through-hole electrode substrateDAINIPPON PRINTING CO LTD·Filed 2016·Granted Apr 9, 2019·6 cites·20 claims
- 0387US10790221B2Through-hole electrode substrateDAINIPPON PRINTING CO LTD·Filed 2020·Granted Sep 29, 2020·2 cites·20 claims
- 0485US2024404934A1Through-hole electrode substrateDAINIPPON PRINTING CO LTD·Filed 2024·Application pending·0 cites
- 0577US12080637B2Through-hole electrode substrateDAINIPPON PRINTING CO LTD·Filed 2022·Granted Sep 3, 2024·0 cites·20 claims
- 0673US6777752B2Complementary MOS semiconductor deviceSEIKO INSTR INC·Filed 2001·Granted Aug 17, 2004·18 cites·37 claims
- 0770US11362028B2Through-hole electrode substrateDAINIPPON PRINTING CO LTD·Filed 2020·Granted Jun 14, 2022·0 cites·2 claims
- 0863US10580727B2Through-hole electrode substrateDAINIPPON PRINTING CO LTD·Filed 2019·Granted Mar 3, 2020·0 cites·20 claims
- 0953US7606012B2Semiconductor device and designing method for the sameSEIKO INSTR INC·Filed 2006·Granted Oct 20, 2009·0 cites·10 claims
- 1051US6809391B1Short-wavelength photodiode of enhanced sensitivity with low leak current and method of manufacturing photodiodeSEIKO INSTR INC·Filed 2000·Granted Oct 26, 2004·4 cites·9 claims
- 1133US2004191995A1Method of manufacturing a semiconductor deviceFiled 2004·Application pending·0 cites
- 1231US6297120B1Method of manufacturing a semiconductor deviceSEIKO INSTR INC·Filed 1999·Granted Oct 2, 2001·3 cites·30 claims
Join the waitlist — get patent alerts
Get an alert when Sumio Koiwa files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →