Inventor · disambiguated record
Woon Kab Jung
Also filed as: JUNG WOON KAB
7 granted patents·1 pending application·26 citations·filing 2012–2024
81Inventor score
Technology areasH10W
Top patents by PatentIndex Score
8 records- 0193US10347562B1Methods and structures for increasing the allowable die size in TMV packagesAMKOR TECHNOLOGY INC·Filed 2017·Granted Jul 9, 2019·7 cites·20 claims
- 0291US9721872B1Methods and structures for increasing the allowable die size in TMV packagesNICHOLLS LOUIS W·Filed 2012·Granted Aug 1, 2017·16 cites·21 claims
- 0382US2025022784A1Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrateAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 0476US12107035B2Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrateAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Oct 1, 2024·0 cites·20 claims
- 0575US10714408B2Semiconductor devices and methods of making semiconductor devicesAMKOR TECHNOLOGY INC·Filed 2019·Granted Jul 14, 2020·1 cites·21 claims
- 0673US10090230B2Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrateAMKOR TECHNOLOGY INC·Filed 2014·Granted Oct 2, 2018·2 cites·21 claims
- 0770US11488892B2Methods and structures for increasing the allowable die size in TMV packagesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Nov 1, 2022·0 cites·20 claims
- 0859US11430723B2Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrateAMKOR TECHNOLOGY INC·Filed 2018·Granted Aug 30, 2022·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →