Inventor · disambiguated record
Kunmo Chu
Also filed as: CHU KUNMO
6 granted patents·3 pending applications·13 citations·filing 2015–2024
74Inventor score
Files withSAMSUNG ELECTRONICS CO LTD9
Top patents by PatentIndex Score
9 records- 0181US2025066644A1Metal particles for adhesive paste, solder paste composition including the same, and method of preparing metal particles for adhesive pasteSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0280US10249604B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Apr 2, 2019·5 cites·21 claims
- 0379US9831211B2Anisotropic conductive material, electronic device including anisotropic conductive material, and method of manufacturing electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Nov 28, 2017·5 cites·30 claims
- 0477US10392518B2Paste material, wiring member formed from the paste material, and electronic device including the wiring memberSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Aug 27, 2019·3 cites·31 claims
- 0574US12370632B2Metal particle for adhesive paste, method of preparing the same, solder paste including the same, composite bonding structure formed therefrom, and semiconductor device including the composite bonding structureSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 29, 2025·0 cites·25 claims
- 0674US2022235248A1Metal particles for adhesive paste, solder paste composition including the same, and method of preparing metal particles for adhesive pasteSAMSUNG ELECTRONICS CO LTD·Filed 2021·Application pending·0 cites
- 0758US12288765B2Hybrid bonding structures, semiconductor devices having the same, and methods of manufacturing the semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 29, 2025·0 cites·41 claims
- 0858US11804462B2Hybrid bonding structures and semiconductor devices including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 31, 2023·0 cites·20 claims
- 0951US2025214181A1Solder composition, method of preparing the same, and method of manufacturing semiconductor package using the solder compositionSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →