Inventor · disambiguated record
Jing-Yao Chang
Also filed as: CHANG JING-YAO
18 granted patents·5 pending applications·81 citations·filing 2005–2023
91Inventor score
Top patents by PatentIndex Score
23 records- 0190US9706656B2Signal transmission board and method for manufacturing the sameIND TECH RES INST·Filed 2015·Granted Jul 11, 2017·9 cites·21 claims
- 0288US7626208B2Bendable solid state planar light source structureIND TECH RES INST·Filed 2006·Granted Dec 1, 2009·33 cites·12 claims
- 0386US8866309B2Chip package structureIND TECH RES INST·Filed 2012·Granted Oct 21, 2014·9 cites·21 claims
- 0483US8130509B2Package carrierTSAI TSUNG-FU·Filed 2009·Granted Mar 6, 2012·11 cites·23 claims
- 0582US11756858B2Power module with housing having bending sectionsIND TECH RES INST·Filed 2021·Granted Sep 12, 2023·1 cites·22 claims
- 0679US8742600B2Dual-phase intermetallic interconnection structure and method of fabricating the sameIND TECH RES INST·Filed 2013·Granted Jun 3, 2014·5 cites·17 claims
- 0777US7871836B2Method of manufacturing bendable solid state lightingIND TECH RES INST·Filed 2009·Granted Jan 18, 2011·6 cites·10 claims
- 0876US10672677B2Semiconductor package structureIND TECH RES INST·Filed 2018·Granted Jun 2, 2020·2 cites·20 claims
- 0974US10743411B1Ceramic substrate component/assembly with raised thermal metal pad, and method for fabricating the componentICP TECH CO LTD·Filed 2020·Granted Aug 11, 2020·1 cites·8 claims
- 1074US10490478B2Chip packaging and composite system boardIND TECH RES INST·Filed 2017·Granted Nov 26, 2019·2 cites·29 claims
- 1165US12500174B2Power modulePOWERX SEMICONDUCTOR CORP·Filed 2023·Granted Dec 16, 2025·0 cites·20 claims
- 1261US9484315B2Chip structure having bonding wireIND TECH RES INST·Filed 2015·Granted Nov 1, 2016·1 cites·9 claims
- 1358US12500169B2Embedded packaging structureIND TECH RES INST·Filed 2021·Granted Dec 16, 2025·0 cites·17 claims
- 1458US9240370B1Power moduleIND TECH RES INST·Filed 2014·Granted Jan 19, 2016·1 cites·20 claims
- 1557US12381133B2Power semiconductor deviceIND TECH RES INST·Filed 2022·Granted Aug 5, 2025·0 cites·10 claims
- 1655US11239211B2Electronic device having a curved portion between a plurality of conductive portions on a substrateIND TECH RES INST·Filed 2020·Granted Feb 1, 2022·0 cites·22 claims
- 1745US2012125669A1Package carrierTSAI TSUNG-FU·Filed 2012·Application pending·0 cites
- 1844US11114387B2Electronic packaging structureIND TECH RES INST·Filed 2018·Granted Sep 7, 2021·0 cites·5 claims
- 1944US2017084521A1Semiconductor package structureIND TECH RES INST·Filed 2016·Application pending·0 cites
- 2037US2006110108A1Tunable light transceiver moduleHSIEH TSUNG-FU·Filed 2005·Application pending·0 cites
- 2137US2013043599A1Chip package process and chip package structureIND TECH RES INST·Filed 2012·Application pending·0 cites
- 2236US8598686B2Electronic device package structure with a hydrophilic protection layer and method for fabricating the sameCHANG TAO-CHIH·Filed 2010·Granted Dec 3, 2013·0 cites·25 claims
- 2336US2018233477A1Electronic packaging structureIND TECH RES INST·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →