Inventor · disambiguated record
Priyadarshi Panda
Also filed as: PANDA PRIYADARSHI
13 granted patents·6 pending applications·23 citations·filing 2017–2025
87Inventor score
Top patents by PatentIndex Score
19 records- 0194US12265377B2Autonomous substrate processing systemAPPLIED MATERIALS INC·Filed 2023·Granted Apr 1, 2025·3 cites·17 claims
- 0294US11709477B2Autonomous substrate processing systemAPPLIED MATERIALS INC·Filed 2021·Granted Jul 25, 2023·3 cites·18 claims
- 0393US11621266B2Method of testing a gap fill for DRAMAPPLIED MATERIALS INC·Filed 2021·Granted Apr 4, 2023·2 cites·11 claims
- 0489US10529602B1Method and apparatus for substrate fabricationAPPLIED MATERIALS INC·Filed 2018·Granted Jan 7, 2020·5 cites·20 claims
- 0586US11171141B2Gap fill methods of forming buried word lines in DRAM without forming bottom voidsAPPLIED MATERIALS INC·Filed 2020·Granted Nov 9, 2021·2 cites·20 claims
- 0680US10903112B2Methods and apparatus for smoothing dynamic random access memory bit line metalAPPLIED MATERIALS INC·Filed 2019·Granted Jan 26, 2021·2 cites·20 claims
- 0779US10718101B2Economically viable atmospheric water generatorPANDA PRIYADARSHI·Filed 2017·Granted Jul 21, 2020·6 cites·4 claims
- 0867US2025239602A1Li ion product for accessible energy density optimizationPANDA PRIYADARSHI·Filed 2024·Application pending·0 cites
- 0966US11751382B2Method of processing dramAPPLIED MATERIALS INC·Filed 2022·Granted Sep 5, 2023·0 cites·16 claims
- 1066US2024308874A1X-processing of nmc cathode active material (cam) for longer cycle life and stabilityPANDA PRIYADARSHI·Filed 2023·Application pending·0 cites
- 1165US2025157802A1Etch feedback for control of upstream processAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 1261US12237158B2Etch feedback for control of upstream processAPPLIED MATERIALS INC·Filed 2020·Granted Feb 25, 2025·0 cites·14 claims
- 1360US11329052B2Method of processing DRAMAPPLIED MATERIALS INC·Filed 2020·Granted May 10, 2022·0 cites·13 claims
- 1458US2020235104A1Cap Layer For Bit Line Resistance ReductionAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 1555US10700072B2Cap layer for bit line resistance reductionAPPLIED MATERIALS INC·Filed 2018·Granted Jun 30, 2020·0 cites·20 claims
- 1653US11631680B2Methods and apparatus for smoothing dynamic random access memory bit line metalAPPLIED MATERIALS INC·Filed 2020·Granted Apr 18, 2023·0 cites·12 claims
- 1746US11658043B2Selective anisotropic metal etchAPPLIED MATERIALS INC·Filed 2021·Granted May 23, 2023·0 cites·20 claims
- 1846US2022165593A1Feedforward control of multi-layer stacks during device fabricationAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 1944US2020051994A1Memory device improvementAPPLIED MATERIALS INC·Filed 2018·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →