Inventor · disambiguated record
Yasutsugu Aoki
Also filed as: AOKI YASUTSUGU
9 granted patents·355 citations·filing 1996–2006
89Inventor score
Files withSEIKO EPSON CORP9
Top patents by PatentIndex Score
9 records- 0193US5753886APlasma treatment apparatus and methodSEIKO EPSON CORP·Filed 1996·Granted May 19, 1998·269 cites·37 claims
- 0276US6620282B2Method and apparatus for solid bonding, a conductor bonding method, a packaging method, and a bonding agent and a method for manufacturing a bonding agentSEIKO EPSON CORP·Filed 2001·Granted Sep 16, 2003·11 cites·10 claims
- 0376US6221197B1Method and apparatus for solid bonding, a conductor bonding method, a packaging method, and a bonding agent and a method for manufacturing a bonding agentSEIKO EPSON CORP·Filed 1998·Granted Apr 24, 2001·30 cites·32 claims
- 0468US7051863B2Transferring apparatus, carrying apparatus, and transferring methodSEIKO EPSON CORP·Filed 2004·Granted May 30, 2006·11 cites·24 claims
- 0566US7222721B2Transferring apparatus, carrying apparatus, and transferring methodSEIKO EPSON CORP·Filed 2006·Granted May 29, 2007·2 cites·31 claims
- 0665US7308757B2Intermediate product manufacturing apparatus, and intermediate product manufacturing methodSEIKO EPSON CORP·Filed 2004·Granted Dec 18, 2007·11 cites·5 claims
- 0765US7182201B2Wafer carrying apparatus and wafer carrying methodSEIKO EPSON CORP·Filed 2004·Granted Feb 27, 2007·10 cites·2 claims
- 0861US7032739B2Intermediate product carrying apparatus, and intermediate product carrying methodSEIKO EPSON CORP·Filed 2004·Granted Apr 25, 2006·8 cites·8 claims
- 0959US6604672B2Method and apparatus for solid bonding, a conductor bonding method, a packaging method, and a bonding agent and a method for manufacturing a bonding agentSEIKO EPSON CORP·Filed 2001·Granted Aug 12, 2003·3 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →