Inventor · disambiguated record
Lei Ping Lai
Also filed as: LAI LEI · LAI LEI P · LAI LEI PING
6 granted patents·1 pending application·333 citations·filing 1994–2025
86Inventor score
Files withMOTOROLA INC3BEIJING ZITIAO NETWORK TECHNOLOGY CO LTD2EMC CORP1SAMSUNG AUSTIN SEMICONDUCTOR1
Top patents by PatentIndex Score
7 records- 0187US6224472B1Retaining ring for chemical mechanical polishingSAMSUNG AUSTIN SEMICONDUCTOR·Filed 1999·Granted May 1, 2001·142 cites·22 claims
- 0286US5961373AProcess for forming a semiconductor deviceMOTOROLA INC·Filed 1997·Granted Oct 5, 1999·72 cites·25 claims
- 0382US5899745AMethod of chemical mechanical polishing (CMP) using an underpad with different compression regions and polishing pad thereforMOTOROLA INC·Filed 1997·Granted May 4, 1999·68 cites·29 claims
- 0473US9172584B1Method and system for high-availability cluster data protectionEMC CORP·Filed 2012·Granted Oct 27, 2015·4 cites·17 claims
- 0573US5605615AMethod and apparatus for plating metalsMOTOROLA INC·Filed 1994·Granted Feb 25, 1997·47 cites·12 claims
- 0670US2025284387A1Video processing method, device, and storage mediumBEIJING ZITIAO NETWORK TECHNOLOGY CO LTD·Filed 2025·Application pending·0 cites
- 0764US12346549B2Video processing method and apparatus, device, and mediumBEIJING ZITIAO NETWORK TECHNOLOGY CO LTD·Filed 2024·Granted Jul 1, 2025·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →