Inventor · disambiguated record
Dale E. Ibbotson
Also filed as: IBBOTSON DALE · IBBOTSON DALE E · IBBOTSON DALE EDWARD
12 granted patents·851 citations·filing 1982–2013
93Inventor score
Files withLUCENT TECHNOLOGIES INC3ALTERA CORP2AMERICAN TELEPHONE & TELEGRAPH2AT & T BELL LAB2AT & T CORP1
Top patents by PatentIndex Score
12 records- 0198US4918031AProcesses depending on plasma generation using a helical resonatorAMERICAN TELEPHONE & TELEGRAPH·Filed 1988·Granted Apr 17, 1990·238 cites·38 claims
- 0297US4498953AEtching techniquesAT & T BELL LAB·Filed 1983·Granted Feb 12, 1985·287 cites·22 claims
- 0389US5654903AMethod and apparatus for real time monitoring of wafer attributes in a plasma etch processLUCENT TECHNOLOGIES INC·Filed 1995·Granted Aug 5, 1997·136 cites·25 claims
- 0482US5653894AActive neural network determination of endpoint in a plasma etch processLUCENT TECHNOLOGIES INC·Filed 1995·Granted Aug 5, 1997·80 cites·5 claims
- 0567US5494697AProcess for fabricating a device using an ellipsometric techniqueAT & T CORP·Filed 1993·Granted Feb 27, 1996·44 cites·9 claims
- 0663US7883946B1Angled implantation for deep submicron device optimizationALTERA CORP·Filed 2008·Granted Feb 8, 2011·1 cites·29 claims
- 0761US5877407APlasma etch end point detection processLUCENT TECHNOLOGIES INC·Filed 1997·Granted Mar 2, 1999·24 cites·12 claims
- 0861US4397711ACrystallographic etching of III-V semiconductor materialsBELL TELEPHONE LABOR INC·Filed 1982·Granted Aug 9, 1983·23 cites·8 claims
- 0948US8519403B1Angled implantation for deep submicron device optimizationHSU CHE TA·Filed 2011·Granted Aug 27, 2013·0 cites·8 claims
- 1040US9171897B1Area efficient series MIM capacitorALTERA CORP·Filed 2013·Granted Oct 27, 2015·0 cites·21 claims
- 1140US4960656ADevices and process for producing devices containing silicon nitride filmsAT & T BELL LAB·Filed 1989·Granted Oct 2, 1990·10 cites·23 claims
- 1236US4689115AGaseous etching processAMERICAN TELEPHONE & TELEGRAPH·Filed 1985·Granted Aug 25, 1987·8 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →