Inventor · disambiguated record
Masao Kayaba
Also filed as: KAYABA MASAO
2 granted patents·1 pending application·0 citations·filing 2002–2023
27Inventor score
Technology areasH05K
Files withISHIKAWA TECH LABORATORY CO LTD2
Top patents by PatentIndex Score
3 records- 0167US12392015B2Printed wiring board, printed circuit board, and electronic componentISHIKAWA TECH LABORATORY CO LTD·Filed 2023·Granted Aug 19, 2025·0 cites·3 claims
- 0260US11802322B2Method for manufacturing solder product, solder, soldered component, printed wiring board, printed circuit board, wire, soldered product, flexible printed board, electronic component, method for manufacturing tin article, method for manufacturing tin intermediate product, tin intermediate product, and conductive memberISHIKAWA TECH LABORATORY CO LTD·Filed 2021·Granted Oct 31, 2023·0 cites·2 claims
- 0327US2004078964A1Land portion of printed wiring board, method for manufacturing printed wiring board, and printed wiring board mounting methodFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →