Inventor · disambiguated record
Sunwon Kang
Also filed as: KANG SUNWON
22 granted patents·4 pending applications·52 citations·filing 2009–2024
93Inventor score
Top patents by PatentIndex Score
26 records- 0194US10861826B2Substrate assembly semiconductor package including the same and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Dec 8, 2020·9 cites·8 claims
- 0291US11769746B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 26, 2023·2 cites·20 claims
- 0390US9633973B2Semiconductor packageKIM KILSOO·Filed 2015·Granted Apr 25, 2017·8 cites·18 claims
- 0486US11495576B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 8, 2022·2 cites·19 claims
- 0583US8981574B2Semiconductor packageKIM KILSOO·Filed 2013·Granted Mar 17, 2015·6 cites·13 claims
- 0682US8680685B2Semiconductor package and method for fabricating the sameLIM HWAN-SIK·Filed 2010·Granted Mar 25, 2014·9 cites·33 claims
- 0781US10211176B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Feb 19, 2019·3 cites·13 claims
- 0879US8823172B2Semiconductor package and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Sep 2, 2014·4 cites·18 claims
- 0977US10985138B2Semiconductor package having a plurality of chips and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 20, 2021·2 cites·16 claims
- 1071US10720408B2High-speed semiconductor modulesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jul 21, 2020·1 cites·20 claims
- 1169US11257723B2Inspection system and method for inspecting semiconductor package, and method of fabricating semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 22, 2022·1 cites·20 claims
- 1269US10522506B2High-speed semiconductor modulesKIM KYOUNGSOO·Filed 2016·Granted Dec 31, 2019·2 cites·18 claims
- 1366US12420348B2Solder reflow apparatus and method of manufacturing electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Sep 23, 2025·0 cites·20 claims
- 1466US11664348B2Substrate assembly semiconductor package including the same and method of manufacturing 1HE semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 30, 2023·0 cites·19 claims
- 1563US11848255B2Semiconductor package structure on a PCB and semiconductor module including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 19, 2023·0 cites·15 claims
- 1663US11018121B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 25, 2021·1 cites·19 claims
- 1759US2025038156A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1857US10943881B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 9, 2021·0 cites·10 claims
- 1955US10720382B2Semiconductor package structure and semiconductor module including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jul 21, 2020·0 cites·11 claims
- 2054US8933747B2Semiconductor chip package including voltage generation circuit with reduced power noiseKANG SUNWON·Filed 2012·Granted Jan 13, 2015·2 cites·18 claims
- 2152US12165974B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 10, 2024·0 cites·17 claims
- 2249US12009342B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 11, 2024·0 cites·20 claims
- 2346US2010096754A1Semiconductor package, semiconductor module, and method for fabricating the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 2443US10797030B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 6, 2020·0 cites·18 claims
- 2532US2017069582A1Semiconductor device including passive equalizer circuitSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 2631US2016013158A1Semiconductor packageKANG HYO-SOON·Filed 2015·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Sunwon Kang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →