Inventor · disambiguated record
Keng Hsu
Also filed as: HSU KENG · HSU KENG H · HSU KENG-HAO
11 granted patents·12 pending applications·42 citations·filing 2006–2024
85Inventor score
Files withHSU KENG5UNIV LOUISVILLE RES FOUND INC5UNIV ARIZONA STATE4IVALDI GROUP INC2NUVOTON TECHNOLOGY CORP2
Top patents by PatentIndex Score
23 records- 0187US7998330B2Direct nanoscale patterning of metals using polymer electrolytesUNIV ILLINOIS·Filed 2008·Granted Aug 16, 2011·21 cites·25 claims
- 0286US11117212B2Systems and methods for additive manufacturing utilizing localized ultrasound-enhanced material flow and fusioningUNIV ARIZONA STATE·Filed 2018·Granted Sep 14, 2021·4 cites·19 claims
- 0386US8980656B2Method of forming an array of high aspect ratio semiconductor nanostructuresLI XIULING·Filed 2010·Granted Mar 17, 2015·12 cites·20 claims
- 0485US10710353B2Systems and methods for laser preheating in connection with fused deposition modelingHSU KENG·Filed 2016·Granted Jul 14, 2020·4 cites·15 claims
- 0573US12403545B2Systems and methods for additive manufacturing utilizing localized ultrasound-enhanced material flow and fusioningUNIV ARIZONA STATE·Filed 2021·Granted Sep 2, 2025·0 cites·13 claims
- 0670US2023166329A1Intermittent material-tool interaction control enabling continuous deposition of solid metal voxels using local high-frequency, small-displacement oscillatory strain energyHSU KENG·Filed 2022·Application pending·0 cites
- 0770US2025025940A1Deposition of solid-metal voxelsHSU KENG·Filed 2022·Application pending·0 cites
- 0868US11579524B2Electrochemical imprinting of micro- and nano-structures in porous silicon, silicon, and other semiconductorsUNIV ARIZONA STATE·Filed 2021·Granted Feb 14, 2023·0 cites·15 claims
- 0965US12208575B2Laser surface healing systems and methodsHSU KENG·Filed 2023·Granted Jan 28, 2025·0 cites·13 claims
- 1065US2024025114A1In-process ultrasonic polling of 3d printed crystalline/semicrystalline electroactive polymersUNIV LOUISVILLE RES FOUND INC·Filed 2023·Application pending·0 cites
- 1165US2023158569A1Acoustic-energy based material deposition and repairIVALDI GROUP INC·Filed 2023·Application pending·0 cites
- 1263US2025162248A1Oscillatory strain-assisted voxel shaping and joining for 3d-printingHSU KENG·Filed 2024·Application pending·0 cites
- 1361US11590577B2Acoustic-energy based material deposition and repairIVALDI GROUP INC·Filed 2019·Granted Feb 28, 2023·0 cites·11 claims
- 1460US11724451B2In-process ultrasonic polling of 3D printed crystalline/semi-crystalline electroactive polymersUNIV LOUISVILLE RES FOUND INC·Filed 2019·Granted Aug 15, 2023·0 cites·10 claims
- 1557US12449873B2Mainboard device and update method of basic input-output system thereofNUVOTON TECHNOLOGY CORP·Filed 2023·Granted Oct 21, 2025·0 cites·10 claims
- 1651US9581986B2Input device providing control information to host deviceNUVOTON TECHNOLOGY CORP·Filed 2014·Granted Feb 28, 2017·1 cites·18 claims
- 1750US2020300818A1High-frequency oscillatory plastic deformation based solid-state material deposition for metal surface repairUNIV LOUISVILLE RES FOUND INC·Filed 2020·Application pending·0 cites
- 1849US2019202116A1Acoustic energy enabled property isotropy in extrusion-based 3d printed materialsUNIV LOUISVILLE RES FOUND INC·Filed 2018·Application pending·0 cites
- 1949US2025258457A1Imaging devices, apparatus, and methods for the development of image recording mediaPOLAROID INT B V·Filed 2024·Application pending·0 cites
- 2049US2023211558A1Robotic systems for additive manufacturingUNIV LOUISVILLE RES FOUND INC·Filed 2022·Application pending·0 cites
- 2148US2019384167A1Electrochemical imprinting of micro- and nano-structures in porous silicon, silicon, and other semiconductorsUNIV ARIZONA STATE·Filed 2018·Application pending·0 cites
- 2241US2007215480A1Pattern transfer by solid state electrochemical stampingFANG NICHOLAS X·Filed 2006·Application pending·0 cites
- 2337US2019039137A1Process controlled dissolvable supports in 3d printing of metal or ceramic componentsARIZONA BOARD OF REGENT ON BEHALF OF ARIZONA STATE UNIV·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →