Inventor · disambiguated record
Peter J. Lindgren
Also filed as: LINDGREN PETER J · LINDGREN PETER JAMES
35 granted patents·3 pending applications·258 citations·filing 1999–2014
97Inventor score
Top patents by PatentIndex Score
38 records- 0196US8722508B2Low harmonic RF switch in SOIIBM·Filed 2013·Granted May 13, 2014·23 cites·18 claims
- 0296US8674472B2Low harmonic RF switch in SOIBOTULA ALAN B·Filed 2010·Granted Mar 18, 2014·25 cites·19 claims
- 0395US8674423B2Semiconductor structure having vias and high density capacitorsCOLLINS DAVID S·Filed 2011·Granted Mar 18, 2014·26 cites·18 claims
- 0492US7741226B2Optimal tungsten through wafer via and process of fabricating sameIBM·Filed 2008·Granted Jun 22, 2010·31 cites·22 claims
- 0591US8236663B2Dual-damascene process to fabricate thick wire structureCOOLBAUGH DOUGLAS D·Filed 2009·Granted Aug 7, 2012·16 cites·27 claims
- 0689US9171778B2Dual-damascene process to fabricate thick wire structureIBM·Filed 2014·Granted Oct 27, 2015·7 cites·17 claims
- 0783US7602068B2Dual-damascene process to fabricate thick wire structureINTERNAT MACHINES CORP·Filed 2006·Granted Oct 13, 2009·8 cites·9 claims
- 0882US8039356B2Through silicon via lithographic alignment and registrationIBM·Filed 2010·Granted Oct 18, 2011·6 cites·10 claims
- 0982US8039314B2Metal adhesion by induced surface roughnessIBM·Filed 2008·Granted Oct 18, 2011·8 cites·18 claims
- 1081US8753950B2Dual-damascene process to fabricate thick wire structureCOOLBAUGH DOUGLAS D·Filed 2012·Granted Jun 17, 2014·4 cites·20 claims
- 1181US8510329B2Distributed and interactive database architecture for parallel and asynchronous data processing of complex data and for real-time query processingBALKIR NEVZAT HURKAN·Filed 2005·Granted Aug 13, 2013·26 cites·91 claims
- 1280US8338265B2Silicided trench contact to buried conductive layerCOOLBAUGH DOUGLAS D·Filed 2008·Granted Dec 25, 2012·7 cites·16 claims
- 1379US8101494B2Structure, design structure and method of manufacturing a structure having VIAS and high density capacitorsCOLLINS DAVID S·Filed 2008·Granted Jan 24, 2012·7 cites·24 claims
- 1475US8645898B2Structure and design structure for high-Q value inductor and method of manufacturing the sameDING HANYI·Filed 2012·Granted Feb 4, 2014·3 cites·20 claims
- 1575US8232173B2Structure and design structure for high-Q value inductor and method of manufacturing the sameDING HANYI·Filed 2010·Granted Jul 31, 2012·3 cites·10 claims
- 1674US8089135B2Back-end-of-line wiring structures with integrated passive elements and design structures for a radiofrequency integrated circuitLINDGREN PETER J·Filed 2008·Granted Jan 3, 2012·6 cites·16 claims
- 1773US7859114B2IC chip and design structure with through wafer vias dishing correctionIBM·Filed 2008·Granted Dec 28, 2010·5 cites·19 claims
- 1872US8445306B2Hybrid MEMS RF switch and method of fabricating sameLINDGREN PETER J·Filed 2008·Granted May 21, 2013·5 cites·17 claims
- 1971US8872281B2Silicided trench contact to buried conductive layerCOOLBAUGH DOUGLAS D·Filed 2012·Granted Oct 28, 2014·3 cites·20 claims
- 2069US8631570B2Through wafer vias with dishing correction methodsLINDGREN PETER J·Filed 2012·Granted Jan 21, 2014·2 cites·2 claims
- 2168US8234606B2Metal wiring structure for integration with through substrate viasCOLLINS DAVID S·Filed 2011·Granted Jul 31, 2012·2 cites·20 claims
- 2268US7898063B2Through substrate annular via including plug fillerIBM·Filed 2008·Granted Mar 1, 2011·3 cites·8 claims
- 2368US7696586B2Cobal disilicide structureIBM·Filed 2008·Granted Apr 13, 2010·2 cites·13 claims
- 2466US6797610B1Sublithographic patterning using microtrenchingIBM·Filed 2002·Granted Sep 28, 2004·13 cites·12 claims
- 2564US7968975B2Metal wiring structure for integration with through substrate viasIBM·Filed 2008·Granted Jun 28, 2011·2 cites·25 claims
- 2663US8119522B1Method of fabricating damascene structuresGAMBINO JEFFREY P·Filed 2010·Granted Feb 21, 2012·1 cites·17 claims
- 2762US7863180B2Through substrate via including variable sidewall profileIBM·Filed 2008·Granted Jan 4, 2011·2 cites·13 claims
- 2860US8136084B2Arranging through silicon vias in IC layoutDEAN JR DONALD R·Filed 2009·Granted Mar 13, 2012·4 cites·14 claims
- 2959US8166651B2Through wafer vias with dishing correction methodsLINDGREN PETER J·Filed 2008·Granted May 1, 2012·1 cites·9 claims
- 3057US2014164281A1Distributed and Interactive Database Architecture for Parallel and Asynchronous Data Processing of Complex Data and for Real-Time Query ProcessingEXPERIAN MARKETING SOLUTIONS·Filed 2013·Application pending·0 cites
- 3156US8748207B2Hybrid MEMS RF switch and method of fabricating sameIBM·Filed 2013·Granted Jun 10, 2014·0 cites·11 claims
- 3250US8293638B2Method of fabricating damascene structuresGAMBINO JEFFREY P·Filed 2012·Granted Oct 23, 2012·0 cites·14 claims
- 3346US2011129996A1Through substrate annular via including plug fillerIBM·Filed 2011·Application pending·0 cites
- 3444US2008174015A1Removal of etching process residual in semiconductor fabricationHERRIN RUSSELL THOMAS·Filed 2007·Application pending·0 cites
- 3543US8125013B2Structure, design structure and method of manufacturing a structure having VIAS and high density capacitorsCOLLINS DAVID S·Filed 2008·Granted Feb 28, 2012·0 cites·24 claims
- 3640US6335294B1Wet cleans for cobalt disilicide processingIBM·Filed 1999·Granted Jan 1, 2002·7 cites·24 claims
- 3739US7411258B2Cobalt disilicide structureIBM·Filed 2001·Granted Aug 12, 2008·0 cites·9 claims
- 3835US8643190B2Through substrate via including variable sidewall profileCOONEY III EDWARD CRANDAL·Filed 2010·Granted Feb 4, 2014·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →