Inventor · disambiguated record
Gerald S. Leatherman
Also filed as: LEATHERMAN GERALD S
2 granted patents·3 pending applications·10 citations·filing 2005–2014
56Inventor score
Top patents by PatentIndex Score
5 records- 0177US8933564B2Landing structure for through-silicon viaPELTO CHRISTOPHER M·Filed 2012·Granted Jan 13, 2015·6 cites·27 claims
- 0271US7889013B2Microelectronic die having CMOS ring oscillator thereon and method of using sameINTEL CORP·Filed 2007·Granted Feb 15, 2011·4 cites·11 claims
- 0351US2015137368A1Landing structure for through-silicon viaINTEL CORP·Filed 2014·Application pending·0 cites
- 0437US2007045833A1Copper bump barrier cap to reduce electrical resistanceZHONG TING·Filed 2005·Application pending·0 cites
- 0527US2014191410A1Damage monitor structure for through-silicon via (tsv) arraysLEATHERMAN GERALD S·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →