Inventor · disambiguated record
Kiyoaki Tsumura
Also filed as: TSUMURA KIYOAKI
15 granted patents·455 citations·filing 1988–2002
95Inventor score
Top patents by PatentIndex Score
15 records- 0182US6288376B1Method and apparatus for melting a bump by induction heatingMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Sep 11, 2001·46 cites·11 claims
- 0282US4821944AMethod for bonding a wire and bonding apparatusMITSUBISHI ELECTRIC CORP·Filed 1988·Granted Apr 18, 1989·60 cites·27 claims
- 0380US5565378AProcess of passivating a semiconductor device bonding pad by immersion in O2 or O3 solutionMITSUBISHI ELECTRIC CORP·Filed 1992·Granted Oct 15, 1996·66 cites·20 claims
- 0472US5334803ASemiconductor device and method of producing the sameMITSUBISHI ELECTRIC CORP·Filed 1992·Granted Aug 2, 1994·40 cites·12 claims
- 0570US5293066ASemiconductor device mounting structure including lead frame and lead plateMITSUBISHI ELECTRIC CORP·Filed 1992·Granted Mar 8, 1994·43 cites·15 claims
- 0669US5229646ASemiconductor device with a copper wires ball bonded to aluminum electrodesMITSUBISHI ELECTRIC CORP·Filed 1992·Granted Jul 20, 1993·41 cites·2 claims
- 0768US4886200ACapillary tip for bonding a wireMITSUBISHI ELECTRIC CORP·Filed 1988·Granted Dec 12, 1989·34 cites·4 claims
- 0858US5003373AStructure of electrode junction for semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1988·Granted Mar 26, 1991·22 cites·7 claims
- 0958US4984056ASemiconductor integrated circuit deviceMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Jan 8, 1991·21 cites·3 claims
- 1057US5116783AMethod of producing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1989·Granted May 26, 1992·22 cites·2 claims
- 1154US5023697ASemiconductor device with copper wire ball bondingMITSUBISHI ELECTRIC CORP·Filed 1990·Granted Jun 11, 1991·22 cites·9 claims
- 1248US5124277AMethod of ball bonding to non-wire bonded electrodes of semiconductor devicesMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Jun 23, 1992·17 cites·1 claims
- 1345US6907053B2Semiconductor laser device, and optical pickup apparatus using the deviceMITSUMI ELECTRIC CO LTD·Filed 2002·Granted Jun 14, 2005·2 cites·20 claims
- 1445US5093712AResin-sealed semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1990·Granted Mar 3, 1992·16 cites·7 claims
- 1533USRE35496ESemiconductor device and method of producing the sameMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Apr 29, 1997·3 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →