Inventor · disambiguated record
Hajime Nakazono
Also filed as: NAKAZONO HAJIME
6 granted patents·3 pending applications·3 citations·filing 2016–2022
67Inventor score
Files withTATSUTA ELECTRIC WIRE & CABLE CO LTD9
Top patents by PatentIndex Score
9 records- 0180US11510349B2Shield package and method of manufacturing shield packageTATSUTA ELECTRIC WIRE & CABLE CO LTD·Filed 2019·Granted Nov 22, 2022·3 cites·8 claims
- 0265US2024425640A1Thermally conductive compositionTATSUTA ELECTRIC WIRE & CABLE CO LTD·Filed 2022·Application pending·0 cites
- 0350US12016165B2Shield packageTATSUTA ELECTRIC WIRE & CABLE CO LTD·Filed 2019·Granted Jun 18, 2024·0 cites·12 claims
- 0447US11912897B2Electroconductive coating material and method for producing shielded package using said electroconductive coating materialTATSUTA ELECTRIC WIRE & CABLE CO LTD·Filed 2019·Granted Feb 27, 2024·0 cites·7 claims
- 0546US10153066B2Conductive paste and multilayer board using the sameTATSUTA ELECTRIC WIRE & CABLE CO LTD·Filed 2016·Granted Dec 11, 2018·0 cites·14 claims
- 0644US11834586B2Conductive paint, method for producing shield package using the same, and method for producing resin molded article having shield layerTATSUTA ELECTRIC WIRE & CABLE CO LTD·Filed 2020·Granted Dec 5, 2023·0 cites·20 claims
- 0743US2023151228A1Conductive composition and method for producing shielded package using sameTATSUTA ELECTRIC WIRE & CABLE CO LTD·Filed 2021·Application pending·0 cites
- 0841US2019292381A1Conductive coating material and production method for shielded package using conductive coating materialTATSUTA ELECTRIC WIRE & CABLE CO LTD·Filed 2017·Application pending·0 cites
- 0940US11191198B2Shield packageTATSUTA ELECTRIC WIRE & CABLE CO LTD·Filed 2018·Granted Nov 30, 2021·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →