Inventor · disambiguated record
Lieng Loo
Also filed as: LOO LIENG
7 granted patents·3 pending applications·1 citations·filing 2019–2024
68Inventor score
Top patents by PatentIndex Score
10 records- 0179US11192782B1Method for preparing silicon wafer with rough surface and silicon waferAAC ACOUSTIC TECH SHENZHEN CO LTD·Filed 2020·Granted Dec 7, 2021·1 cites·9 claims
- 0257US2025357910A1Resonator and method for forming the sameAAC TECHNOLOGIES PTE LTD·Filed 2024·Application pending·0 cites
- 0352US2024372528A1Acoustic resonator and method for manufacturing acoustic resonatorAAC TECHNOLOGIES PTE LTD·Filed 2023·Application pending·0 cites
- 0452US2024372519A1Method for fabricating film bulk acoustic resonator (fbar), fbar, and filterAAC TECHNOLOGIES PTE LTD·Filed 2023·Application pending·0 cites
- 0551US11305988B2Method for preparing silicon wafer with rough surface and silicon waferAAC ACOUSTIC TECH SHENZHEN CO LTD·Filed 2020·Granted Apr 19, 2022·0 cites·8 claims
- 0646US10818511B1Plane polishing method of silicon wafer and processing method of silicon waferAAC ACOUSTIC TECH SHENZHEN CO LTD·Filed 2019·Granted Oct 27, 2020·0 cites·12 claims
- 0744US10947110B2MEMS microphone and manufacturing method for making sameAAC TECHNOLOGIES PTE LTD·Filed 2019·Granted Mar 16, 2021·0 cites·3 claims
- 0842US11482664B2Planarization methodAAC ACOUSTIC TECH SHENZHEN CO LTD·Filed 2020·Granted Oct 25, 2022·0 cites·7 claims
- 0940US11569791B2Planarization methodAAC ACOUSTIC TECH SHENZHEN CO LTD·Filed 2020·Granted Jan 31, 2023·0 cites·9 claims
- 1036US11111134B2Method for processing conductive structureAAC ACOUSTIC TECH SHENZHEN CO LTD·Filed 2019·Granted Sep 7, 2021·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →