Inventor · disambiguated record
Hideaki Katakura
Also filed as: KATAKURA HIDEAKI
14 granted patents·3 pending applications·16 citations·filing 2014–2022
85Inventor score
Files withFUJI ELECTRIC CO LTD17
Top patents by PatentIndex Score
17 records- 0189US9543217B2Semiconductor device and method of manufacturing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2016·Granted Jan 10, 2017·8 cites·5 claims
- 0283US10141299B2Semiconductor device with protective element portionFUJI ELECTRIC CO LTD·Filed 2017·Granted Nov 27, 2018·3 cites·21 claims
- 0381US9196585B2Polysilicon fuse, semiconductor device having overlapping polysilicon fuse sections and method of severing polysilicon fuseFUJI ELECTRIC CO LTD·Filed 2014·Granted Nov 24, 2015·5 cites·9 claims
- 0464US10964686B2Semiconductor device and method of manufacturing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2020·Granted Mar 30, 2021·0 cites·1 claims
- 0558US10720421B2Semiconductor device and method of manufacturing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2018·Granted Jul 21, 2020·0 cites·24 claims
- 0651US2023050067A1Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2022·Application pending·0 cites
- 0749US11133228B2Semiconductor integrated circuitFUJI ELECTRIC CO LTD·Filed 2020·Granted Sep 28, 2021·0 cites·4 claims
- 0848US9412694B2Polysilicon fuse, manufacturing method thereof, and semiconductor device including polysilicon fuseFUJI ELECTRIC CO LTD·Filed 2014·Granted Aug 9, 2016·0 cites·10 claims
- 0942US11670388B2Trimming methodFUJI ELECTRIC CO LTD·Filed 2021·Granted Jun 6, 2023·0 cites·11 claims
- 1042US9537486B2Semiconductor device and power conversion device using the sameFUJI ELECTRIC CO LTD·Filed 2014·Granted Jan 3, 2017·0 cites·9 claims
- 1141US10580907B2Semiconductor device and semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2018·Granted Mar 3, 2020·0 cites·10 claims
- 1240US9865586B2Semiconductor device and method for testing the semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2016·Granted Jan 9, 2018·0 cites·13 claims
- 1338US2019051573A1Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2018·Application pending·0 cites
- 1437US9880203B2Semiconductor device and method for manufacturing the semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2015·Granted Jan 30, 2018·0 cites·14 claims
- 1537US2018076201A1Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2017·Application pending·0 cites
- 1634US9419132B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2015·Granted Aug 16, 2016·0 cites·12 claims
- 1733US10276661B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2015·Granted Apr 30, 2019·0 cites·16 claims
Join the waitlist — get patent alerts
Get an alert when Hideaki Katakura files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →