Inventor · disambiguated record
Jo-Lin Lan
Also filed as: LAN JO-LIN
11 granted patents·10 pending applications·36 citations·filing 2008–2025
86Inventor score
Top patents by PatentIndex Score
21 records- 0194US10304700B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 28, 2019·10 cites·24 claims
- 0292US12094728B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 17, 2024·1 cites·20 claims
- 0387US10204870B2Semiconductor device and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 12, 2019·4 cites·20 claims
- 0486US8241372B2Electrochemical device and method of fabricating the sameCHENG HAI-PENG·Filed 2009·Granted Aug 14, 2012·18 cites·8 claims
- 0583US12469800B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 11, 2025·0 cites·20 claims
- 0679US2025357202A1Semiconductor package redistribution structure and fabrication method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0778US2025357337A1Interconnection structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0876US2024395566A1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0974US11817399B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 14, 2023·0 cites·20 claims
- 1070US11699598B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 11, 2023·0 cites·20 claims
- 1169US2024282628A1Semiconductor package redistribution structure and fabrication method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1267US2024321733A1Interconnection structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1362US8298434B2Method of forming an electrode including an electrochemical catalyst layerWEI TZU-CHIEN·Filed 2009·Granted Oct 30, 2012·2 cites·14 claims
- 1461US11031351B2Method of manufacturing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 8, 2021·0 cites·20 claims
- 1561US8349394B2Method of forming an electrode including an electrochemical catalyst layerTRIPOD TECHNOLOGY CORP·Filed 2008·Granted Jan 8, 2013·1 cites·6 claims
- 1659US2025329675A1Semiconductor device and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1758US10867811B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 15, 2020·0 cites·20 claims
- 1858US2025349674A1Semiconductor die packages and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1952US2010071759A1Electrochemical Device and Method of Fabricating the SameTRIPOD TECHNOLOGY CORP·Filed 2009·Application pending·0 cites
- 2042US2010101623A1Packaging structureTRIPOD TECHNOLOGY CORP·Filed 2009·Application pending·0 cites
- 2141US2010101644A1Electrolyte composition and dye-sensitized solar cell (dssc) comprising the sameTRIPOD TECHNOLOGY CORP·Filed 2009·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →