Inventor · disambiguated record
Mark Aaron Chan Chan
Also filed as: CHAN MARK AARON · CHAN MARK AARON CHAN
13 granted patents·3 pending applications·35 citations·filing 2008–2021
87Inventor score
Files withGEN ELECTRIC12BAYERISCHE MOTOREN WERKE AG1GE ENERGY POWER CONVERSION TECHNOLOGY LTD1NG KIM CHOON1UNIV SINGAPORE1
Top patents by PatentIndex Score
16 records- 0196US10784750B2Electric motor having an integrated cooling system and methods of cooling an electric motorGEN ELECTRIC·Filed 2018·Granted Sep 22, 2020·10 cites·19 claims
- 0288US9439316B2Submersible power distribution system and methods of assembly thereofGEN ELECTRIC·Filed 2014·Granted Sep 6, 2016·8 cites·19 claims
- 0387US11252847B2Heat dissipation system and an associated method thereofGEN ELECTRIC·Filed 2017·Granted Feb 15, 2022·6 cites·6 claims
- 0483US10916947B2System and method for direct current power transmissionGEN ELECTRIC·Filed 2015·Granted Feb 9, 2021·3 cites·22 claims
- 0579US11885229B2Electric motor having an integrated cooling system and methods of cooling an electric motorGEN ELECTRIC·Filed 2020·Granted Jan 30, 2024·1 cites·20 claims
- 0675US9777966B2System for cooling heat generating electrically active components for subsea applicationsGEN ELECTRIC·Filed 2014·Granted Oct 3, 2017·3 cites·9 claims
- 0773US10590916B2Multisiphon passive cooling systemGEN ELECTRIC·Filed 2018·Granted Mar 17, 2020·2 cites·20 claims
- 0866US10497642B2Integrated power semiconductor packaging apparatus and power converterGEN ELECTRIC·Filed 2018·Granted Dec 3, 2019·1 cites·9 claims
- 0965US9894815B1Heat removal assembly for use with a power converterGEN ELECTRIC·Filed 2016·Granted Feb 13, 2018·1 cites·18 claims
- 1061US11997839B2Heat dissipation system and an associated method thereofGEN ELECTRIC·Filed 2021·Granted May 28, 2024·0 cites·19 claims
- 1149US11951858B2Charging device for connecting an electrical energy store of a motor vehicle to a charging stationBAYERISCHE MOTOREN WERKE AG·Filed 2019·Granted Apr 9, 2024·0 cites·9 claims
- 1247US10249554B2Heat transfer assembly for a heat emitting deviceGEN ELECTRIC·Filed 2017·Granted Apr 2, 2019·0 cites·14 claims
- 1346US10638648B2Cooling system with pressure regulationGE ENERGY POWER CONVERSION TECHNOLOGY LTD·Filed 2016·Granted Apr 28, 2020·0 cites·9 claims
- 1441US2010132924A1Cooling device for electronic componentsUNIV SINGAPORE·Filed 2008·Application pending·0 cites
- 1527US2019110380A1Cooling system and methods of assembling the sameGEN ELECTRIC·Filed 2016·Application pending·0 cites
- 1627US2012024500A1Thermosyphon for cooling electronic componentsNG KIM CHOON·Filed 2010·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Mark Aaron Chan Chan files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →