Inventor · disambiguated record
Toyohiko Fujisawa
Also filed as: FUJISAWA TOYOHIKO
17 granted patents·2 pending applications·46 citations·filing 2002–2020
91Inventor score
Files withDOW CORNING TORAY CO LTD7DOW TORAY CO LTD5DOW CORNING TORAY SILICONE2FUJISAWA TOYOHIKO2DOW CORNING1
Top patents by PatentIndex Score
19 records- 0192US9947858B2Curable organopolysiloxane composition for transducers and applications of such curable silicone composition for transducersDOW CORNING·Filed 2013·Granted Apr 17, 2018·8 cites·20 claims
- 0286US11549043B2Multicomponent-curable thermally-conductive silicone gel composition, thermally-conductive member and heat dissipation structureDOW TORAY CO LTD·Filed 2018·Granted Jan 10, 2023·2 cites·16 claims
- 0383US11555118B2Curable organopolysiloxane composition and a protectant or adhesive composition of electric/electronic partsDOW TORAY CO LTD·Filed 2017·Granted Jan 17, 2023·1 cites·12 claims
- 0482US7990033B2Display device, method of manufacturing thereof, and method of improving visibilityDOW CORNING TORAY CO LTD·Filed 2007·Granted Aug 2, 2011·8 cites·20 claims
- 0581US9227183B2Microparticles and curable organopolysiloxane composition containing the sameDOW CORNING TORAY CO LTD·Filed 2013·Granted Jan 5, 2016·3 cites·16 claims
- 0678US10358542B2Adhesion promoter and curable organopolysiloxane composition containing sameDOW CORNING TORAY CO LTD·Filed 2015·Granted Jul 23, 2019·2 cites·18 claims
- 0777US10604612B2Curable organopolysiloxane composition, semiconductor sealant comprising same, and semiconductor deviceDOW CORNING TORAY CO LTD·Filed 2015·Granted Mar 31, 2020·1 cites·18 claims
- 0876US11396616B2Liquid curable silicone adhesive composition, cured product thereof, and use thereofDOW TORAY CO LTD·Filed 2018·Granted Jul 26, 2022·2 cites·17 claims
- 0975US8729195B2Organosilicon compound, method for producing thereof, and curable silicone composition containing the sameTANIGUCHI YOSHINORI·Filed 2010·Granted May 20, 2014·3 cites·11 claims
- 1073US11319412B2Thermally conductive silicone compoundDOW TORAY CO LTD·Filed 2017·Granted May 3, 2022·2 cites·18 claims
- 1170US9403982B2Curable silicone composition and cured product thereofDOW CORNING TORAY CO LTD·Filed 2013·Granted Aug 2, 2016·2 cites·20 claims
- 1265US8093333B2Hot-melt silicone adhesiveFUJISAWA TOYOHIKO·Filed 2006·Granted Jan 10, 2012·1 cites·14 claims
- 1360US10077339B2Curable organopolysiloxane composition, and protective-agent or adhesive-agent composition for electrical/electronic componentsDOW CORNING TORAY CO LTD·Filed 2015·Granted Sep 18, 2018·1 cites·18 claims
- 1458US12378414B2Curable organopolysiloxane composition, cured product, and electric/electronic equipmentDOW SILICONES CORP·Filed 2019·Granted Aug 5, 2025·0 cites·12 claims
- 1555US7198853B2Adhesive sheet of cross-linked silicone, method of manufacturing thereof, and deviceDOW CORNING TORAY SILICONE·Filed 2002·Granted Apr 3, 2007·7 cites·12 claims
- 1647US7534659B2Silicone-based adhesive sheet, method of bonding a semiconductor chip to a chip attachment component, and a semiconductor deviceDOW CORNING TORAY SILICONE·Filed 2003·Granted May 19, 2009·3 cites·23 claims
- 1745US2022185992A1Multi-component type thermally conductive silicone-gel composition, thermally conductive material and heat-emission structureDOW TORAY CO LTD·Filed 2020·Application pending·0 cites
- 1842US7897717B2Insulating liquid die-bonding agent and semiconductor deviceDOW CORNING TORAY CO LTD·Filed 2006·Granted Mar 1, 2011·0 cites·12 claims
- 1941US2011224344A1Liquid Die Bonding AgentFUJISAWA TOYOHIKO·Filed 2009·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Toyohiko Fujisawa files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →