Inventor · disambiguated record
Chen W. Tseng
Also filed as: TSENG CHEN W · Tseng Chen-Wei
16 granted patents·1 pending application·247 citations·filing 2007–2017
94Inventor score
Top patents by PatentIndex Score
17 records- 0197US7576557B1Method and apparatus for mitigating one or more event upsetsXILINX INC·Filed 2008·Granted Aug 18, 2009·68 cites·19 claims
- 0293US8786310B1Partially programming an integrated circuit using control memory cellsLU WEIGUANG·Filed 2012·Granted Jul 22, 2014·31 cites·17 claims
- 0391US7990173B1Single event upset mitigationXILINX INC·Filed 2010·Granted Aug 2, 2011·12 cites·17 claims
- 0489US8099625B1Self-checking and self-correcting internal configuration port circuitryTSENG CHEN WEI·Filed 2009·Granted Jan 17, 2012·37 cites·20 claims
- 0589US7589558B1Method and apparatus for configuring an integrated circuitXILINX INC·Filed 2008·Granted Sep 15, 2009·25 cites·17 claims
- 0685US8922242B1Single event upset mitigationXILINX INC·Filed 2014·Granted Dec 30, 2014·7 cites·20 claims
- 0784US10056356B1Chip package circuit board moduleUNIMICRON TECHNOLOGY CORP·Filed 2017·Granted Aug 21, 2018·5 cites·8 claims
- 0884US9208043B1Method and apparatus for fault injection and verification on an integrated circuitXILINX INC·Filed 2013·Granted Dec 8, 2015·11 cites·20 claims
- 0984US7650585B1Implementing a user design in a programmable logic device with single event upset mitigationXILINX INC·Filed 2007·Granted Jan 19, 2010·15 cites·20 claims
- 1083US8635581B1Method and apparatus for single event upset (SEU) detection and correctionXILINX INC·Filed 2013·Granted Jan 21, 2014·8 cites·20 claims
- 1183US8633730B1Power control using global control signal to selected circuitry in a programmable integrated circuitTSENG CHEN W·Filed 2012·Granted Jan 21, 2014·9 cites·20 claims
- 1273US9436562B1Circuit network with an error detection system for mitigation of error propagationXILINX INC·Filed 2014·Granted Sep 6, 2016·3 cites·18 claims
- 1373US8713409B1Bit error mitigationTSENG CHEN W·Filed 2012·Granted Apr 29, 2014·6 cites·20 claims
- 1473US7626415B1Method and apparatus for configuring an integrated circuitXILINX INC·Filed 2008·Granted Dec 1, 2009·7 cites·19 claims
- 1572US10497847B2Structure and manufacturing method of heat dissipation substrate and package structure and method thereofUNIMICRON TECHNOLOGY CORP·Filed 2017·Granted Dec 3, 2019·2 cites·20 claims
- 1665US10159151B1Chip package circuit board moduleUNIMICRON TECHNOLOGY CORP·Filed 2017·Granted Dec 18, 2018·1 cites·6 claims
- 1737US2017196095A1Circuit board and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →