Inventor · disambiguated record
Chee Kong Lee
Also filed as: LEE CHEE K · LEE CHEE-KONG
11 granted patents·6 pending applications·116 citations·filing 1991–2023
87Inventor score
Top patents by PatentIndex Score
17 records- 0191US8151873B1Expandable packer with mandrel undercuts and sealing boost featureLEE CHEE K·Filed 2011·Granted Apr 10, 2012·20 cites·20 claims
- 0288US8662161B2Expandable packer with expansion induced axially movable support featureLEE CHEE K·Filed 2011·Granted Mar 4, 2014·14 cites·20 claims
- 0386US9140094B2Open hole expandable packer with extended reach featureLEE CHEE K·Filed 2011·Granted Sep 22, 2015·12 cites·29 claims
- 0479US5183784ASilver-glass pastesJOHNSON MATTHEY INC·Filed 1991·Granted Feb 2, 1993·65 cites·9 claims
- 0572US11314536B2Quantum variational method, apparatus, and storage medium for simulating quantum systemsTencent America LLC·Filed 2019·Granted Apr 26, 2022·3 cites·17 claims
- 0666US10357841B2Metal cap assembly for optical communicationsMATERION CORP·Filed 2016·Granted Jul 23, 2019·1 cites·4 claims
- 0762US9560781B2Metal cap assembly for optical communicationsMATERION CORP·Filed 2014·Granted Jan 31, 2017·1 cites·12 claims
- 0861US2025139486A1Generating a transformed dataset by quantum transformation of an original dataset and a quantum feature mapIBM·Filed 2023·Application pending·0 cites
- 0958US2025200417A1Enabling quantum machine learning to be used effectively with classical data by mapping classical data into a quantum state spaceIBM·Filed 2023·Application pending·0 cites
- 1056US2024428108A1Measurement-based quantum machine learningIBM·Filed 2023·Application pending·0 cites
- 1150US11855608B2Systems and methods for packaging an acoustic device in an integrated circuit (IC)RF360 SINGAPORE PTE LTD·Filed 2020·Granted Dec 26, 2023·0 cites·36 claims
- 1249US11487555B2Running PBS jobs in kubernetesTENCENT TECH SHENZHEN CO LTD·Filed 2020·Granted Nov 1, 2022·0 cites·18 claims
- 1340US11227806B2Air cavity package using high temperature silicone adhesiveMATERION CORP·Filed 2017·Granted Jan 18, 2022·0 cites·19 claims
- 1440US10163743B2Copper flanged air cavity packages for high frequency devicesMATERION CORP·Filed 2017·Granted Dec 25, 2018·0 cites·17 claims
- 1538US2013049555A1Selective plating of frame lid assemblyRAMESH KOTHANDAPANI·Filed 2012·Application pending·0 cites
- 1630US2017069560A1Air cavity packageMATERION CORP·Filed 2015·Application pending·0 cites
- 1729US2017239756A1Laser manufacturing of solder preformsMATERION CORP·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →