Inventor · disambiguated record
Hironobu Shibata
Also filed as: SHIBATA HIRONOBU
11 granted patents·15 pending applications·86 citations·filing 2005–2024
87Inventor score
Top patents by PatentIndex Score
26 records- 0196US7420320B2Piezoelectric thin film device and method for manufacturing the sameTOSHIBA KK·Filed 2007·Granted Sep 2, 2008·41 cites·7 claims
- 0295US7323805B2Piezoelectric thin film device and method for manufacturing the sameTOSHIBA KK·Filed 2005·Granted Jan 29, 2008·32 cites·15 claims
- 0373US8900962B2Method for manufacturing semiconductor deviceYAMASHITA DAISUKE·Filed 2011·Granted Dec 2, 2014·3 cites·7 claims
- 0472US7770274B2Piezoelectric thin film device and method for manufacturing the sameTOSHIBA KK·Filed 2007·Granted Aug 10, 2010·5 cites·6 claims
- 0569US2025210937A1Method for manufacturing light-emitting device and light-emitting deviceNICHIA CORP·Filed 2024·Application pending·0 cites
- 0668US7268392B2Trench gate semiconductor device with a reduction in switching lossTOSHIBA KK·Filed 2005·Granted Sep 11, 2007·4 cites·12 claims
- 0766US10514135B2Light emitting deviceNICHIA CORP·Filed 2017·Granted Dec 24, 2019·1 cites·19 claims
- 0859US11956870B2Light-source deviceNICHIA CORP·Filed 2020·Granted Apr 9, 2024·0 cites·20 claims
- 0952US2015056727A1Method of inspecting semiconductor device, method of fabricating semiconductor device, and inspection toolTOSHIBA KK·Filed 2014·Application pending·0 cites
- 1049US2013244351A1Method of inspecting semiconductor device, method of fabricating semiconductor device, and inspection toolTOSHIBA KK·Filed 2013·Application pending·0 cites
- 1146US9041143B2Semiconductor devicesTOSHIBA KK·Filed 2013·Granted May 26, 2015·0 cites·11 claims
- 1245US2025016919A1Magnetic ceramic substrate, substrate manufacturing method, and circulatorMITSUBISHI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 1343US10944143B2Non-reciprocal circuit element and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Mar 9, 2021·0 cites·9 claims
- 1443US9761922B2Non-reciprocal circuitMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Sep 12, 2017·0 cites·18 claims
- 1543US2015262947A1Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2014·Application pending·0 cites
- 1642US11062832B2Nonreciprocal circuit element and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Jul 13, 2021·0 cites·7 claims
- 1742US2015069614A1Semiconductor device and manufacturing method thereofTOSHIBA KK·Filed 2014·Application pending·0 cites
- 1840US2013249063A1Shield plate, method for manufacturing a semiconductor device, and semiconductor deviceTOSHIBA KK·Filed 2013·Application pending·0 cites
- 1940US2020118859A1Apparatus for processing substrateTOSHIBA KK·Filed 2019·Application pending·0 cites
- 2039US2019139702A1Irreversible circuit element, irreversible circuit device, and method for manufacturing said element and deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Application pending·0 cites
- 2137US2008024041A1Thin film piezoelectric resonator and manufacturing method thereofTOSHIBA KK·Filed 2007·Application pending·0 cites
- 2237US2007194863A1Film bulk acoustic resonator and method of manufacturing sameTOSHIBA KK·Filed 2007·Application pending·0 cites
- 2337US2008042524A1Film bulk acoustic resonator and method for manufacturingTOSHIBA KK·Filed 2007·Application pending·0 cites
- 2436US2012238044A1Method for manufacturing semiconductor device and reinforcing plateSHIBATA HIRONOBU·Filed 2011·Application pending·0 cites
- 2535US2007057599A1Film bulk acoustic resonator and method for manufacturing the sameTOSHIBA KK·Filed 2006·Application pending·0 cites
- 2634US2012178223A1Method of Manufacturing High Breakdown Voltage Semiconductor DeviceNISHIJO YOSHINOSUKE·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →