Inventor · disambiguated record
Kuo-Hsien Cheng
Also filed as: CHENG KUO F · CHENG KUO-HSIEN
11 granted patents·7 pending applications·187 citations·filing 1997–2024
90Inventor score
Files withTAIWAN SEMICONDUCTOR MFG9TAIWAN SEMICONDUCTOR MFG CO LTD4BENQ CORP3HSU SHAO-TA1K BRIDGE ELECTRONICS CO LTD1
Top patents by PatentIndex Score
18 records- 0192US11955444B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 9, 2024·3 cites·20 claims
- 0286US6017791AMulti-layer silicon nitride deposition method for forming low oxidation temperature thermally oxidized silicon nitride/silicon oxide (no) layerTAIWAN SEMICONDUCTOR MFG·Filed 1997·Granted Jan 25, 2000·84 cites·15 claims
- 0369US2024258257A1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0464US6146991ABarrier metal composite layer featuring a thin plasma vapor deposited titanium nitride capping layerTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Nov 14, 2000·31 cites·20 claims
- 0562US10038000B2Memory cell and fabricating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 31, 2018·1 cites·20 claims
- 0662US7072261B2Driving methodBENQ CORP·Filed 2003·Granted Jul 4, 2006·5 cites·21 claims
- 0758US5763303ARapid thermal chemical vapor deposition procedure for a self aligned, polycide contact structureTAIWAN SEMICONDUCTOR MFG·Filed 1997·Granted Jun 9, 1998·17 cites·24 claims
- 0853US2015361547A1Method and apparatus for cleaning chemical vapor deposition chamberTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Application pending·0 cites
- 0951US2006233080A1Driving methodBENQ CORP·Filed 2006·Application pending·0 cites
- 1048US7205634B2MIM structure and fabrication process with improved capacitance reliabilityTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Apr 17, 2007·4 cites·32 claims
- 1148US5923988ATwo step thermal treatment procedure applied to polycide structures deposited using dichlorosilane as a reactantTAIWAN SEMICONDUCTOR MFG·Filed 1998·Granted Jul 13, 1999·14 cites·21 claims
- 1245US6191035B1Recipe design to prevent tungsten (W) coating on wafer backside for those wafers with poly Si on wafer backsideTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Feb 20, 2001·13 cites·18 claims
- 1343US2008007959A1Backlight module locating device and method thereofK BRIDGE ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 1442US2006219172A1PVD equipment and electrode and deposition ring thereofTAIWAN SEMICONDUCTOR MFG·Filed 2005·Application pending·0 cites
- 1540US6577926B1Method of detecting and controlling in-situ faults in rapid thermal processing systemsTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Jun 10, 2003·13 cites·14 claims
- 1637US2005253268A1Method and structure for improving adhesion between intermetal dielectric layer and cap layerHSU SHAO-TA·Filed 2004·Application pending·0 cites
- 1735US2003210631A1Determination of maximum storage capacity of optical information record mediumBENQ CORP·Filed 2003·Application pending·0 cites
- 1831US6376156B1Prevent defocus issue on wafer with tungsten coating on back-sideTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Apr 23, 2002·2 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →