Inventor · disambiguated record
Ryuji Tomita
Also filed as: TOMITA RYUJI
8 granted patents·3 pending applications·51 citations·filing 2004–2024
83Inventor score
Top patents by PatentIndex Score
11 records- 0194US10283600B2Integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted May 7, 2019·13 cites·20 claims
- 0284US10128245B2Semiconductor devices including active areas with increased contact areaSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Nov 13, 2018·4 cites·20 claims
- 0383US10262937B2Integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 16, 2019·4 cites·15 claims
- 0480US10332984B2Semiconductor devices having reduced contact resistanceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jun 25, 2019·3 cites·7 claims
- 0578US7138700B2Semiconductor device with guard ring for preventing water from entering circuit region from outsideNEC ELECTRONICS CORP·Filed 2004·Granted Nov 21, 2006·26 cites·18 claims
- 0663US12395754B2Minimal repeating unit having reduced blooming effect of clear pixelsOMNIVISION TECH INC·Filed 2023·Granted Aug 19, 2025·0 cites·3 claims
- 0760US7781233B2Method of manufacturing semiconductor deviceNEC ELECTRONICS CORP·Filed 2009·Granted Aug 24, 2010·1 cites·6 claims
- 0852US2025275268A1Image sensor and image sensor manufacturing methodOMNIVISION TECH INC·Filed 2024·Application pending·0 cites
- 0945US2009137096A1Clamp ring for wafer and method of manufacturing semiconductor apparatusNEC ELECTRONICS CORP·Filed 2008·Application pending·0 cites
- 1040US2019115451A1Methods of fabricating semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
- 1139US9728465B2Semiconductor devices with improved source/drain contact resistance and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Aug 8, 2017·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →