Inventor · disambiguated record
Alejandro Reyes
Also filed as: REYES ALEJANDRO
5 granted patents·4 pending applications·310 citations·filing 2000–2009
86Inventor score
Files withMULTI PLANAR TECHNOLOGIES INC5EBARA TECHNOLOGIES1KAJIWARA JIRO1L & P PROPERTY MANAGEMENT CO1
Top patents by PatentIndex Score
9 records- 0196US6558232B1System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal controlMULTI PLANAR TECHNOLOGIES INC·Filed 2000·Granted May 6, 2003·92 cites·27 claims
- 0296US6506105B1System and method for pneumatic diaphragm CMP head having separate retaining ring and multi-region wafer pressure controlMULTI PLANAR TECHNOLOGIES INC·Filed 2000·Granted Jan 14, 2003·105 cites·70 claims
- 0392US6623343B2System and method for CMP head having multi-pressure annular zone subcarrier material removal controlMULTI PLANAR TECHNOLOGIES INC·Filed 2001·Granted Sep 23, 2003·51 cites·38 claims
- 0490US6887132B2Slurry distributor for chemical mechanical polishing apparatus and method of using the sameMULTI PLANAR TECHNOLOGIES INC·Filed 2002·Granted May 3, 2005·44 cites·44 claims
- 0582US6966822B2System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal controlMULTI PLANAR TECHNOLOGIES INC·Filed 2003·Granted Nov 22, 2005·18 cites·13 claims
- 0647US2006105685A1System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal controlKAJIWARA JIRO·Filed 2005·Application pending·0 cites
- 0743US2010206829A1Product displayL & P PROPERTY MANAGEMENT CO·Filed 2009·Application pending·0 cites
- 0842US2005130566A1Slurry distributor for chemical mechanical polishing apparatus and method of using the sameFiled 2005·Application pending·0 cites
- 0931US2004108063A1Method and polishing pad design enabling improved wafer removal from a polishing pad in a CMP processEBARA TECHNOLOGIES·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →