Inventor · disambiguated record
Paul F. Baude
Also filed as: BAUDE PAUL F · BAUDE PAUL FREDERIC
35 granted patents·9 pending applications·2,589 citations·filing 1996–2011
98Inventor score
Files with3M INNOVATIVE PROPERTIES CO40MINNESOTA MINING & MFG2MCCORMICK FRED BOYLE1PALAZZOTTO MICHAEL C1
Top patents by PatentIndex Score
44 records- 0199US6214520B1Thermal transfer element for forming multilayer devices3M INNOVATIVE PROPERTIES CO·Filed 2000·Granted Apr 10, 2001·259 cites·8 claims
- 0299US6194119B1Thermal transfer element and process for forming organic electroluminescent devices3M INNOVATIVE PROPERTIES CO·Filed 1999·Granted Feb 27, 2001·307 cites·27 claims
- 0398US6221553B1Thermal transfer element for forming multilayer devices3M INNOVATIVE PROPERTIES CO·Filed 2000·Granted Apr 24, 2001·179 cites·8 claims
- 0498US6140009AThermal transfer element for forming multilayer devices3M INNOVATIVE PROPERTIES CO·Filed 2000·Granted Oct 31, 2000·155 cites·27 claims
- 0598US6114088AThermal transfer element for forming multilayer devices3M INNOVATIVE PROPERTIES CO·Filed 1999·Granted Sep 5, 2000·338 cites·16 claims
- 0697US6897164B2Aperture masks for circuit fabrication3M INNOVATIVE PROPERTIES CO·Filed 2002·Granted May 24, 2005·137 cites·10 claims
- 0797US6867539B1Encapsulated organic electronic devices and method for making same3M INNOVATIVE PROPERTIES CO·Filed 2000·Granted Mar 15, 2005·155 cites·15 claims
- 0896US7645478B2Methods of making displays3M INNOVATIVE PROPERTIES CO·Filed 2005·Granted Jan 12, 2010·95 cites·23 claims
- 0996US7298084B2Methods and displays utilizing integrated zinc oxide row and column drivers in conjunction with organic light emitting diodes3M INNOVATIVE PROPERTIES CO·Filed 2004·Granted Nov 20, 2007·213 cites·20 claims
- 1096US6821348B2In-line deposition processes for circuit fabrication3M INNOVATIVE PROPERTIES CO·Filed 2002·Granted Nov 23, 2004·77 cites·42 claims
- 1195US6936131B2Encapsulation of organic electronic devices using adsorbent loaded adhesives3M INNOVATIVE PROPERTIES CO·Filed 2002·Granted Aug 30, 2005·121 cites·11 claims
- 1295US6586153B2Multilayer devices formed by multilayer thermal transfer3M INNOVATIVE PROPERTIES CO·Filed 2002·Granted Jul 1, 2003·54 cites·19 claims
- 1394US6291126B2Thermal transfer element and process for forming organic electroluminescent devices3M INNOVATIVE PROPERTIES CO·Filed 2000·Granted Sep 18, 2001·70 cites·14 claims
- 1494US6291116B1Thermal transfer element and process for forming organic electroluminescent devices3M INNOVATIVE PROPERTIES CO·Filed 2000·Granted Sep 18, 2001·82 cites·3 claims
- 1594US6270944B1Thermal transfer element for forming multilayers devices3M INNOVATIVE PROPERTIES CO·Filed 2000·Granted Aug 7, 2001·45 cites·6 claims
- 1691US6582876B2Thermal transfer element and process for forming organic electroluminescent devices3M INNOVATIVE PROPERTIES CO·Filed 2002·Granted Jun 24, 2003·53 cites·36 claims
- 1788US6667215B2Method of making transistors3M INNOVATIVE PROPERTIES CO·Filed 2002·Granted Dec 23, 2003·33 cites·26 claims
- 1888US6410201B2Thermal transfer element and process for forming organic electroluminescent devices3M INNOVATIVE PROPERTIES CO·Filed 2001·Granted Jun 25, 2002·39 cites·31 claims
- 1986US7241688B2Aperture masks for circuit fabrication3M INNOVATIVE PROPERTIES CO·Filed 2005·Granted Jul 10, 2007·5 cites·15 claims
- 2078US7088145B2AC powered logic circuitry3M INNOVATIVE PROPERTIES CO·Filed 2002·Granted Aug 8, 2006·16 cites·50 claims
- 2176US8657985B2Encapsulated organic electronic devices and method for making sameMCCORMICK FRED BOYLE·Filed 2011·Granted Feb 25, 2014·4 cites·20 claims
- 2275US7245151B2Logic circuitry powered by partially rectified AC waveform3M INNOVATIVE PROPERTIES CO·Filed 2006·Granted Jul 17, 2007·10 cites·15 claims
- 2374US7615501B2Method for making a thin film layer3M INNOVATIVE PROPERTIES CO·Filed 2005·Granted Nov 10, 2009·4 cites·29 claims
- 2470US7297361B2In-line deposition processes for circuit fabrication3M INNOVATIVE PROPERTIES CO·Filed 2004·Granted Nov 20, 2007·7 cites·20 claims
- 2568US6855636B2Electrode fabrication methods for organic electroluminscent devices3M INNOVATIVE PROPERTIES CO·Filed 2002·Granted Feb 15, 2005·11 cites·13 claims
- 2666US7352213B2Ac powered logic circuitry3M INNOVATIVE PROPERTIES CO·Filed 2006·Granted Apr 1, 2008·2 cites·46 claims
- 2764US2008038935A1Aperture masks for circuit fabrication3M INNOVATIVE PROPERTIES CO·Filed 2007·Application pending·0 cites
- 2861US7193291B2Organic Schottky diode3M INNOVATIVE PROPERTIES CO·Filed 2004·Granted Mar 20, 2007·7 cites·27 claims
- 2961US7078937B2Logic circuitry powered by partially rectified ac waveform3M INNOVATIVE PROPERTIES CO·Filed 2003·Granted Jul 18, 2006·12 cites·26 claims
- 3054US6611096B1Organic electronic devices having conducting self-doped polymer buffer layers3M INNOVATIVE PROPERTIES CO·Filed 1999·Granted Aug 26, 2003·40 cites·10 claims
- 3154US2008044556A1In-line deposition processes for circuit fabrication3M INNOVATIVE PROPERTIES CO·Filed 2007·Application pending·0 cites
- 3251US2005208205A1Mask and method for making full color display3M INNOVATIVE PROPERTIES CO·Filed 2005·Application pending·0 cites
- 3349US5963573ALight absorbing layer for II-VI semiconductor light emitting devices3M INNOVATIVE PROPERTIES CO·Filed 1997·Granted Oct 5, 1999·14 cites·15 claims
- 3449US2005129841A1Encapsulated organic electronic devices and method for making same3M INNOVATIVE PROPERTIES CO·Filed 2005·Application pending·0 cites
- 3547US10228344B2Sensor element, method of making the same, and sensor device including the samePALAZZOTTO MICHAEL C·Filed 2011·Granted Mar 12, 2019·0 cites·22 claims
- 3647US5974070AII-VI laser diode with facet degradation reduction structure3M INNOVATIVE PROPERTIES CO·Filed 1997·Granted Oct 26, 1999·13 cites·41 claims
- 3747US5818859ABe-containing II-VI blue-green laser diodesMINNESOTA MINING & MFG·Filed 1996·Granted Oct 6, 1998·17 cites·22 claims
- 3846US6058123ASelective etch for II-VI semiconductors3M INNOVATIVE PROPERTIES CO·Filed 1997·Granted May 2, 2000·10 cites·27 claims
- 3945US2003151118A1Aperture masks for circuit fabrication3M INNOVATIVE PROPERTIES CO·Filed 2002·Application pending·0 cites
- 4044US2007215709A1Rfid sensor3M INNOVATIVE PROPERTIES CO·Filed 2006·Application pending·0 cites
- 4143US2005079418A1In-line deposition processes for thin film battery fabrication3M INNOVATIVE PROPERTIES CO·Filed 2003·Application pending·0 cites
- 4242US2001036561A1Multilayer devices formed by multilayer thermal transfer3M INNOVATIVE PROPERTIES CO·Filed 2001·Application pending·0 cites
- 4337US5834330ASelective etch method for II-VI semiconductorsMINNESOTA MINING & MFG·Filed 1996·Granted Nov 10, 1998·5 cites·115 claims
- 4437US2007178710A1Method for sealing thin film transistors3M INNOVATIVE PROPERTIES CO·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →