Inventor · disambiguated record
Tien-Chen Hu
Also filed as: HU TIEN-CHEN
18 granted patents·1 pending application·289 citations·filing 1997–2016
94Inventor score
Files withTAIWAN SEMICONDUCTOR MFG14HU TIEN-CHEN1KAO MAO-LIN1TAIWAN SEMICONDUCTOR MFG CO LTD1TAIWAN SEMICONDUCTORS MFG CO L1
Top patents by PatentIndex Score
19 records- 0194US6517413B1Method for a copper CMP endpoint detection systemTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Feb 11, 2003·105 cites·32 claims
- 0275US6722949B2Ventilated platen/polishing pad assembly for chemcial mechanical polishing and method of usingTAIWAN SEMICONDUCTORS MFG CO L·Filed 2001·Granted Apr 20, 2004·20 cites·18 claims
- 0374US6649077B2Method and apparatus for removing coating layers from alignment marks on a waferTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Nov 18, 2003·21 cites·17 claims
- 0474US6227947B1Apparatus and method for chemical mechanical polishing metal on a semiconductor waferTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted May 8, 2001·35 cites·20 claims
- 0574US5929324AApparatus for detecting leakage in a gas reactorTAIWAN SEMICONDUCTOR MFG·Filed 1997·Granted Jul 27, 1999·34 cites·13 claims
- 0665US6524959B1Chemical mechanical polish (CMP) planarizing method employing derivative signal end-point monitoring and controlTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Feb 25, 2003·11 cites·13 claims
- 0764US6726532B2Belt tensioning assembly for CMP apparatusTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Apr 27, 2004·15 cites·20 claims
- 0863US6837774B2Linear chemical mechanical polishing apparatus equipped with programmable pneumatic support platen and method of usingTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Jan 4, 2005·9 cites·9 claims
- 0960US9281221B2Ultra-high vacuum (UHV) wafer processingTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Mar 8, 2016·1 cites·20 claims
- 1059US7014739B2Convex profile anode for electroplating systemTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Mar 21, 2006·5 cites·13 claims
- 1158US9558974B2Semiconductor processing station and method for processing semiconductor waferKAO MAO-LIN·Filed 2012·Granted Jan 31, 2017·1 cites·23 claims
- 1258US6914337B2Calibration wafer and kitTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Jul 5, 2005·9 cites·15 claims
- 1351US9852932B2Method for processing semiconductor waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 26, 2017·0 cites·20 claims
- 1449US6561880B1Apparatus and method for cleaning the polishing pad of a linear polisherTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted May 13, 2003·5 cites·18 claims
- 1547US6315649B1Wafer mounting plate for a polishing apparatus and method of usingTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Nov 13, 2001·18 cites·26 claims
- 1646US7824243B2Chemical mechanical planarization methodsTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Nov 2, 2010·0 cites·12 claims
- 1741US8057280B2Chemical mechanical planarization apparatusHU TIEN-CHEN·Filed 2010·Granted Nov 15, 2011·0 cites·20 claims
- 1838US7823241B2System for cleaning a waferTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Nov 2, 2010·0 cites·12 claims
- 1928US2005069399A1Apparatus and method for dry-loading of substrates in scrubber cleanerFiled 2003·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Tien-Chen Hu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →