Inventor · disambiguated record
Heiner Bayer
Also filed as: BAYER HEINER
20 granted patents·1 pending application·336 citations·filing 1988–2010
95Inventor score
Top patents by PatentIndex Score
21 records- 0186US6692986B1Method for encapsulating componentsOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2000·Granted Feb 17, 2004·50 cites·17 claims
- 0283US8198783B2Piezoelectric actuator with encapsulation layer having a thickness-varying property gradientBAYER HEINER·Filed 2007·Granted Jun 12, 2012·7 cites·10 claims
- 0383US5242715AProcess for coating or bonding electronic components and subassembliesSIEMENS AG·Filed 1992·Granted Sep 7, 1993·77 cites·12 claims
- 0483US4880662AMethod and apparatus for processing UV-hardenable reaction resin compoundsSIEMENS AG·Filed 1988·Granted Nov 14, 1989·41 cites·6 claims
- 0570US8847453B2Rotor and method for manufacturing a rotor of an electric machineBAYER HEINER·Filed 2010·Granted Sep 30, 2014·5 cites·14 claims
- 0669US5576357AOne-component reactive resin system comprising a cure-inhibiting glycidyl phosphorus compoundSIEMENS AG·Filed 1993·Granted Nov 19, 1996·22 cites·15 claims
- 0769US5366573AUV-curable adhesive semiconductor chip mounting processSIEMENS NIXDORF INF SYST·Filed 1990·Granted Nov 22, 1994·48 cites·6 claims
- 0866US7851978B2Piezo actuator comprising a multilayer encapsulation, and method for the production thereofSIEMENS AG·Filed 2007·Granted Dec 14, 2010·4 cites·9 claims
- 0959US6931699B2Method of producing a surface wave component with a drain for pyroelectric voltageEPCOS AG·Filed 2000·Granted Aug 23, 2005·7 cites·20 claims
- 1052US7255926B2Barrier layer made of a curable resin containing polymeric polyolSHELL OIL CO·Filed 2003·Granted Aug 14, 2007·7 cites·21 claims
- 1152US4970399AMethod and apparatus for processing UV-hardenable reaction resin compoundsSIEMENS AG·Filed 1989·Granted Nov 13, 1990·9 cites·6 claims
- 1249US6200408B1Method for cementing a component to a surfaceSIEMENS AG·Filed 1998·Granted Mar 13, 2001·16 cites·14 claims
- 1344US2008027155A1Thermally Conductive Material for Electronic and/or Electrical Components, and Use ThereofSIEMENS AG SIEMENS AG·Filed 2005·Application pending·0 cites
- 1443US6150435AOne-component epoxy resin for covering electronic componentsSIEMENS AG·Filed 1998·Granted Nov 21, 2000·11 cites·12 claims
- 1542US5468786ARadiation-curable reaction resin systemSIEMENS AG·Filed 1994·Granted Nov 21, 1995·5 cites·6 claims
- 1634US6297344B1Heat-setting single-component LVA (low viscosity adhesive) system for bonding in the micro-rangeSIEMENS AG·Filed 1997·Granted Oct 2, 2001·5 cites·9 claims
- 1733US5158990ACoating compounds for electrical and electronic components containing vitreons fused silicaSIEMENS AG·Filed 1992·Granted Oct 27, 1992·11 cites·10 claims
- 1831US6207732B1Heat-setting single-component LVA (low-viscosity adhesive) system for bonding in the micro-rangeSIEMENS AG·Filed 1997·Granted Mar 27, 2001·3 cites·16 claims
- 1931US6160077AHalogen-free epoxy resinSIEMENS AG·Filed 1998·Granted Dec 12, 2000·2 cites·19 claims
- 2031US5227219ASurface wave components with an acoustically matched damping compoundSIEMENS AG·Filed 1989·Granted Jul 13, 1993·3 cites·6 claims
- 2130US5900286AMethod of producing an attenuating structure on a surface wave componentSIEMENS AG·Filed 1996·Granted May 4, 1999·3 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →