Inventor · disambiguated record
Yu-Tse Lai
Also filed as: LAI YU-TSE
7 granted patents·11 pending applications·3 citations·filing 2021–2025
74Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD18
Top patents by PatentIndex Score
18 records- 0193US12265332B2Method of manufacturing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 1, 2025·2 cites·20 claims
- 0284US12224237B2Method of manufacturing a via and a metal wiring for a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 11, 2025·1 cites·20 claims
- 0383US2025343071A1Via-first self-aligned interconnect formation processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0478US2025364333A1Critical dimension uniformity (cdu) control methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0577US2025343075A1Self-aligned cut-metal layer method and deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0677US2024393690A1Method of manufacturing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0775US2025298303A1Method and system to introduce bright field imaging at stitching area of high-na euv exposureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0874US12386251B2Method and system to introduce bright field imaging at stitching area of high-NA EUV exposureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 12, 2025·0 cites·20 claims
- 0974US2024145297A1Via-first self-aligned interconnect formation processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1074US2025199408A1Method of manufacturing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1173US2024395701A1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1272US2024395549A1Method of manufacturing semiconductor devices and semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1369US12476145B2Self-aligned cut-metal layer methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 18, 2025·0 cites·20 claims
- 1469US11908731B2Via-first self-aligned interconnect formation processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 20, 2024·0 cites·20 claims
- 1568US12494366B2Method of manufacturing semiconductor devices and semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 9, 2025·0 cites·20 claims
- 1668US12476150B2Critical dimension uniformity (CDU) control method and semiconductor substrate processing systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 18, 2025·0 cites·20 claims
- 1758US2023305381A1Euv photo masks and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1857US2023314927A1Euv photo masks and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →