Inventor · disambiguated record
Georg Parteder
Also filed as: PARTEDER GEORG
8 granted patents·2 pending applications·0 citations·filing 2016–2022
70Inventor score
Top patents by PatentIndex Score
10 records- 0151US12362230B2Method of producing a semiconductor body with a trench, semiconductor body with at least one trench and semiconductor deviceAMS AG·Filed 2020·Granted Jul 15, 2025·0 cites·13 claims
- 0247US2024170371A1Semiconductor substrate comprising a through-substrate-via and method for producing thereofAMS OSRAM AG·Filed 2022·Application pending·0 cites
- 0345US12211769B2Through-substrate via and method for manufacturing a through-substrate viaAMS AG·Filed 2020·Granted Jan 28, 2025·0 cites·18 claims
- 0444US11764109B2Method of forming a through-substrate via and a semiconductor device comprising a through-substrate viaAMS AG·Filed 2019·Granted Sep 19, 2023·0 cites·11 claims
- 0541US11367672B2Semiconductor device with through-substrate viaAMS AG·Filed 2019·Granted Jun 21, 2022·0 cites·12 claims
- 0640US11404352B2Semiconductor device with through-substrate via and its method of manufactureAMS AG·Filed 2019·Granted Aug 2, 2022·0 cites·6 claims
- 0739US10243017B2Sensor chip stack and method of producing a sensor chip stackAMS INT AG·Filed 2017·Granted Mar 26, 2019·0 cites·5 claims
- 0838US11355386B2Method for manufacturing a semiconductor device and semiconductor deviceAMS AG·Filed 2018·Granted Jun 7, 2022·0 cites·12 claims
- 0935US11127656B2Crack-resistant semiconductor devicesAMS AG·Filed 2018·Granted Sep 21, 2021·0 cites·19 claims
- 1033US2018158992A1Led moduleTRIDONIC JENNERSDORF GMBH·Filed 2016·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Georg Parteder files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →