Inventor · disambiguated record
Ya Ping Wang
Also filed as: WANG YA · WANG YA-PING
8 granted patents·3 pending applications·25 citations·filing 2006–2023
79Inventor score
Files withSEMICONDUCTOR MFG INT SHANGHAI CORP4HONOR DEVICE CO LTD1INVENTEC APPLIANCES CORP1JIN WEI QIANG1STATS CHIPPAC INC1
Top patents by PatentIndex Score
11 records- 0186US8037918B2Pick-up heads and systems for die bonding and related applicationsSTATS CHIPPAC INC·Filed 2006·Granted Oct 18, 2011·17 cites·16 claims
- 0275US7989941B2Integrated circuit package system with support structure for die overhangSTATS CHIPPAC LTD·Filed 2008·Granted Aug 2, 2011·8 cites·20 claims
- 0357US10950525B2Fabrication method of packaging structureSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2019·Granted Mar 16, 2021·0 cites·19 claims
- 0457US8035336B2Charger slipcover and handheld deviceINVENTEC APPLIANCES CORP·Filed 2008·Granted Oct 11, 2011·0 cites·18 claims
- 0553US11320951B1Transparent conductive electrode of touch panelTPK GLASS SOLUTIONS XIAMEN INC·Filed 2020·Granted May 3, 2022·0 cites·8 claims
- 0652US11335648B2Semiconductor chip fabrication and packaging methods thereofSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2019·Granted May 17, 2022·0 cites·10 claims
- 0752US10446474B2Packaging structure and fabrication method thereofSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2017·Granted Oct 15, 2019·0 cites·16 claims
- 0850US10522479B2Semiconductor chip, and fabrication and packaging methods thereofSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2018·Granted Dec 31, 2019·0 cites·19 claims
- 0946US2025350675A1Port frame, middle frame component, and electronic deviceHONOR DEVICE CO LTD·Filed 2023·Application pending·0 cites
- 1046US2010036506A1Position Deviation Adjustment Apparatus For ProsthesisWANG YA-PING·Filed 2008·Application pending·0 cites
- 1129US2011248391A1Integrated circuit package stacking system with lead overlap and method of manufacture thereofJIN WEI QIANG·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →