Inventor · disambiguated record
Li Hui Lu
Also filed as: LU LI · LU LI HUI
8 granted patents·4 pending applications·184 citations·filing 1999–2019
84Inventor score
Files withSEMICONDUCTOR MFG INT SHANGHAI CORP4LU LI HUI3UNIV SINGAPORE3ATOMIC ENERGY COUNCIL1CHIN CHEE KEONG1
Top patents by PatentIndex Score
12 records- 0193US7767844B2Method for manufacturing diethylene triamine pentaacetic acid derivativeATOMIC ENERGY COUNCIL·Filed 2005·Granted Aug 3, 2010·90 cites·13 claims
- 0288US6621039B2Method and apparatus for creating a free-form three-dimensional metal part using high-temperature direct laser meltingUNIV SINGAPORE·Filed 2001·Granted Sep 16, 2003·63 cites·10 claims
- 0363US6723278B1Method of laser casting copper-based compositesUNIV SINGAPORE·Filed 1999·Granted Apr 20, 2004·30 cites·32 claims
- 0457US10950525B2Fabrication method of packaging structureSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2019·Granted Mar 16, 2021·0 cites·19 claims
- 0552US11335648B2Semiconductor chip fabrication and packaging methods thereofSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2019·Granted May 17, 2022·0 cites·10 claims
- 0652US10446474B2Packaging structure and fabrication method thereofSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2017·Granted Oct 15, 2019·0 cites·16 claims
- 0750US10522479B2Semiconductor chip, and fabrication and packaging methods thereofSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2018·Granted Dec 31, 2019·0 cites·19 claims
- 0844US2008229001A1Solid memory module with extensible capacityLU LI HUI·Filed 2007·Application pending·0 cites
- 0944US2008228994A1Solid memory module structure with extensible capacityLU LI HUI·Filed 2007·Application pending·0 cites
- 1042US2008237157A1Wafer transport systemCHIN CHEE KEONG·Filed 2007·Application pending·0 cites
- 1140US2008224199A1Non-volatile memory module package capability of replacingLU LI HUI·Filed 2007·Application pending·0 cites
- 1219US6652797B1Method for determining resin curing areas in an optical stereolithography processUNIV SINGAPORE·Filed 1999·Granted Nov 25, 2003·1 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →