Inventor · disambiguated record
Fangli Hao
Also filed as: HAO FANGLI · HAO FANGLI J
30 granted patents·5 pending applications·2,211 citations·filing 1997–2024
98Inventor score
Top patents by PatentIndex Score
35 records- 0199US6949204B1Deformation reduction at the main chamberLAM RES CORP·Filed 2004·Granted Sep 27, 2005·415 cites·6 claims
- 0298US6432831B2Gas distribution apparatus for semiconductor processingLAM RES CORP·Filed 2001·Granted Aug 13, 2002·315 cites·17 claims
- 0398US6415736B1Gas distribution apparatus for semiconductor processingLAM RES CORP·Filed 1999·Granted Jul 9, 2002·365 cites·17 claims
- 0498US6245192B1Gas distribution apparatus for semiconductor processingLAM RES CORP·Filed 1999·Granted Jun 12, 2001·407 cites·15 claims
- 0594US10262887B2Pin lifter assembly with small gapLAM RES CORP·Filed 2016·Granted Apr 16, 2019·15 cites·20 claims
- 0694US6350317B1Linear drive system for use in a plasma processing systemLAM RES CORP·Filed 1999·Granted Feb 26, 2002·78 cites·34 claims
- 0792US7685965B1Apparatus for shielding process chamber portLAM RES CORP·Filed 2006·Granted Mar 30, 2010·17 cites·10 claims
- 0891US6889627B1Symmetrical semiconductor reactorLAM RES CORP·Filed 2002·Granted May 10, 2005·54 cites·27 claims
- 0991US6123775AReaction chamber component having improved temperature uniformityLAM RES CORP·Filed 1999·Granted Sep 26, 2000·159 cites·21 claims
- 1090US6363882B1Lower electrode design for higher uniformityLAM RES CORP·Filed 1999·Granted Apr 2, 2002·57 cites·28 claims
- 1189US6433484B1Wafer area pressure controlLAM RES CORP·Filed 2000·Granted Aug 13, 2002·47 cites·27 claims
- 1288US6481723B1Lift pin impact managementLAM RES CORP·Filed 2001·Granted Nov 19, 2002·42 cites·21 claims
- 1387US6669811B2Linear drive system for use in a plasma processing systemLAM RES CORP·Filed 2001·Granted Dec 30, 2003·20 cites·24 claims
- 1486US6188564B1Method and apparatus for compensating non-uniform wafer processing in plasma processing chamberLAM RES CORP·Filed 1999·Granted Feb 13, 2001·76 cites·36 claims
- 1585US10910195B2Substrate support with improved process uniformityLAM RES CORP·Filed 2017·Granted Feb 2, 2021·3 cites·12 claims
- 1685US10741425B2Helium plug design to reduce arcingLAM RES CORP·Filed 2017·Granted Aug 11, 2020·4 cites·16 claims
- 1785US8852685B2Coating method for gas delivery systemKENWORTHY IAN·Filed 2010·Granted Oct 7, 2014·11 cites·11 claims
- 1884US7234222B1Methods and apparatus for optimizing the delivery of a set of gases in a plasma processing systemLAM RES CORP·Filed 2003·Granted Jun 26, 2007·21 cites·18 claims
- 1984US6863784B2Linear drive system for use in a plasma processing systemLAM RES CORP·Filed 2003·Granted Mar 8, 2005·15 cites·33 claims
- 2084US5966586AEndpoint detection methods in plasma etch processes and apparatus thereforLAM RES CORP·Filed 1997·Granted Oct 12, 1999·41 cites·16 claims
- 2178US2024282551A1Substrate support with improved process uniformityLAM RES CORP·Filed 2024·Application pending·0 cites
- 2277US6528949B2Apparatus for elimination of plasma lighting inside a gas line in a strong RF fieldLAM RES CORP·Filed 2001·Granted Mar 4, 2003·12 cites·20 claims
- 2374US9011602B2Pin lifting systemHAO FANGLI J·Filed 2009·Granted Apr 21, 2015·6 cites·10 claims
- 2474US7524397B2Lower electrode design for higher uniformityLAM RES CORP·Filed 2002·Granted Apr 28, 2009·9 cites·20 claims
- 2573US6922867B1Two position robot design for FOUP purgeLAM RES CORP·Filed 2002·Granted Aug 2, 2005·15 cites·20 claims
- 2670US11984296B2Substrate support with improved process uniformityLAM RES CORP·Filed 2021·Granted May 14, 2024·0 cites·13 claims
- 2766US8854451B2Automated bubble detection apparatus and methodCORMIER JOSH·Filed 2011·Granted Oct 7, 2014·2 cites·14 claims
- 2855US2007169704A1Apparatus for shielding process chamber port having dual zone and optical access featuresLAM RES CORP·Filed 2006·Application pending·0 cites
- 2954US9689533B2Coating method for gas delivery systemLAM RES CORP·Filed 2014·Granted Jun 27, 2017·0 cites·20 claims
- 3053US6712929B1Deformation reduction at the main chamberLAM RES CORP·Filed 2000·Granted Mar 30, 2004·3 cites·16 claims
- 3146US2006065523A1Corrosion resistant apparatus for control of a multi-zone nozzle in a plasma processing systemHAO FANGLI·Filed 2004·Application pending·0 cites
- 3245US2006032736A1Deformation reduction at the main chamberLAM RES CORP·Filed 2005·Application pending·0 cites
- 3343US10460978B2Boltless substrate support assemblyLAM RES CORP·Filed 2017·Granted Oct 29, 2019·0 cites·18 claims
- 3441US2018286642A1Electrostatic chuck with flexible wafer temperature controlLAM RES CORP·Filed 2018·Application pending·0 cites
- 3531US6536777B2Sealing techniques suitable for different geometries and constrained spacesLAM RES CORP·Filed 1999·Granted Mar 25, 2003·2 cites·52 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →