Inventor · disambiguated record
Chin Lee Kuan
Also filed as: Kuan Chin Lee
23 granted patents·11 pending applications·26 citations·filing 2016–2025
91Inventor score
Files withINTEL CORP34
Top patents by PatentIndex Score
34 records- 0194US11133256B2Embedded bridge substrate having an integral deviceINTEL CORP·Filed 2019·Granted Sep 28, 2021·12 cites·17 claims
- 0290US11527479B2Stepped interposer for stacked chip packageINTEL CORP·Filed 2020·Granted Dec 13, 2022·2 cites·16 claims
- 0390US10085342B2Microelectronic device having an air core inductorINTEL CORP·Filed 2016·Granted Sep 25, 2018·6 cites·23 claims
- 0482US10516366B2Crystal oscillator interconnect architecture with noise immunityINTEL CORP·Filed 2018·Granted Dec 24, 2019·3 cites·21 claims
- 0573US10171033B2Crystal oscillator interconnect architecture with noise immunityINTEL CORP·Filed 2017·Granted Jan 1, 2019·2 cites·24 claims
- 0667US10083922B2Inductor interconnectINTEL CORP·Filed 2016·Granted Sep 25, 2018·1 cites·22 claims
- 0766US11290059B2Crystal oscillator interconnect architecture with noise immunityINTEL CORP·Filed 2019·Granted Mar 29, 2022·0 cites·17 claims
- 0863US11749606B2Embedded bridge substrate having an integral deviceINTEL CORP·Filed 2021·Granted Sep 5, 2023·0 cites·20 claims
- 0962US2025385168A1Localized thinned board for bottom side component integrationINTEL CORP·Filed 2024·Application pending·0 cites
- 1061US11521943B2Method of forming a capacitive loop substrate assemblyINTEL CORP·Filed 2021·Granted Dec 6, 2022·0 cites·6 claims
- 1161US11502603B2Magnetic sensing scheme for voltage regulator circuitINTEL CORP·Filed 2019·Granted Nov 15, 2022·0 cites·24 claims
- 1261US2025300079A1Stiffener between two substratesINTEL CORP·Filed 2024·Application pending·0 cites
- 1360US12474759B2Platform voltage regulator circuitry configurationsINTEL CORP·Filed 2022·Granted Nov 18, 2025·0 cites·15 claims
- 1460US12256487B2Hybrid boards with embedded planesINTEL CORP·Filed 2021·Granted Mar 18, 2025·0 cites·20 claims
- 1555US2024145450A1Package edge passive component array for improved power integrityINTEL CORP·Filed 2022·Application pending·0 cites
- 1654US11557552B23D trench reference planes for integrated-circuit die packagesINTEL CORP·Filed 2020·Granted Jan 17, 2023·0 cites·17 claims
- 1753US11540395B2Stacked-component placement in multiple-damascene printed wiring boards for semiconductor package substratesINTEL CORP·Filed 2019·Granted Dec 27, 2022·0 cites·17 claims
- 1852US2025210429A1Integrated circuit packages with stiffeners containing semiconductor dies and associated methodsINTEL CORP·Filed 2025·Application pending·0 cites
- 1951US10719109B2Noise mitigation apparatus and method with positively and negatively coupled inductorsINTEL CORP·Filed 2017·Granted Jul 21, 2020·0 cites·20 claims
- 2051US2023124098A1Semiconductor package with warpage controlINTEL CORP·Filed 2021·Application pending·0 cites
- 2150US11437294B2Structures to facilitate heat transfer within package layers to thermal heat sink and motherboardINTEL CORP·Filed 2018·Granted Sep 6, 2022·0 cites·25 claims
- 2250US11031359B2Capacitor loop structureINTEL CORP·Filed 2017·Granted Jun 8, 2021·0 cites·6 claims
- 2350US2023317773A1Technologies for low-leakage on-chip capacitorsINTEL CORP·Filed 2022·Application pending·0 cites
- 2449US11562963B2Stacked semiconductor package and method of forming the sameINTEL CORP·Filed 2020·Granted Jan 24, 2023·0 cites·14 claims
- 2548US11264160B2Extended package air core inductorINTEL CORP·Filed 2019·Granted Mar 1, 2022·0 cites·19 claims
- 2648US2024329715A1Encoding differential signals for power and noise reductionINTEL CORP·Filed 2023·Application pending·0 cites
- 2748US2022199551A1Stiffener and socket embedded metal insert architectures for power deliveryINTEL CORP·Filed 2020·Application pending·0 cites
- 2847US11696409B2Vertical embedded component in a printed circuit board blind holeINTEL CORP·Filed 2016·Granted Jul 4, 2023·0 cites·14 claims
- 2946US11380623B2Shield to protect vias from electromagnetic interferenceINTEL CORP·Filed 2018·Granted Jul 5, 2022·0 cites·17 claims
- 3046US11342852B2Apparatus, system, and method for reducing voltage overshoot in voltage regulatorsINTEL CORP·Filed 2017·Granted May 24, 2022·0 cites·26 claims
- 3146US2022375898A1Programmable capacitance in three-dimensional stacked die architectureINTEL CORP·Filed 2021·Application pending·0 cites
- 3245US10985147B2Capacitors embedded in stiffeners for small form-factor and methods of assembling sameINTEL CORP·Filed 2018·Granted Apr 20, 2021·0 cites·15 claims
- 3340US2020098674A1Package edge mounted frame structuresINTEL CORP·Filed 2018·Application pending·0 cites
- 3438US2017373587A1Compact partitioned capacitor for multiple voltage domains with improved decouplingINTEL CORP·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →