Inventor · disambiguated record

Kun-Chih Chan

Also filed as: CHAN KUN-CHIH

2 granted patents·22 citations·filing 2012–2013

53Inventor score

Technology areasG01R H10P

Files withCHANG KAI-JUN1 POWERTECH TECHNOLOGY INC1

Top patents by PatentIndex Score

2 records

0184US8703508B2Method for wafer-level testing diced multi-chip stacked packagesCHANG KAI-JUN·Filed 2012·Granted Apr 22, 2014·22 cites·15 claims
0238US9250288B2Wafer-level testing method for singulated 3D-stacked chip cubesPOWERTECH TECHNOLOGY INC·Filed 2013·Granted Feb 2, 2016·0 cites·5 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →