Inventor · disambiguated record
Mitsuru Ozono
Also filed as: OZONO MITSURU
18 granted patents·2 pending applications·286 citations·filing 1997–2007
94Inventor score
Top patents by PatentIndex Score
20 records- 0187US6361831B1Paste application method for die bondingMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Mar 26, 2002·50 cites·1 claims
- 0284US6797544B2Semiconductor device, method of manufacturing the device and method of mounting the deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Sep 28, 2004·37 cites·23 claims
- 0383US8192578B2Chip pickup apparatus, chip pickup method, chip releasing device and chip releasing methodHAJI HIROSHI·Filed 2006·Granted Jun 5, 2012·10 cites·16 claims
- 0482US7632710B2Method for soldering electronic component and soldering structure of electronic componentPANASONIC CORP·Filed 2006·Granted Dec 15, 2009·10 cites·9 claims
- 0582US6209196B1Method of mounting bumped electronic componentsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Apr 3, 2001·46 cites·22 claims
- 0680US8614118B2Component bonding method, component laminating method and bonded component structureHAJI HIROSHI·Filed 2007·Granted Dec 24, 2013·11 cites·6 claims
- 0777US7632374B2Method and apparatus for picking up semiconductor chip and suction and exfoliation tool used thereforPANASONIC CORP·Filed 2003·Granted Dec 15, 2009·21 cites·9 claims
- 0876US7409761B2Electronic component mounting apparatus and method of mounting electronic componentsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Aug 12, 2008·5 cites·10 claims
- 0972US6179198B1Method of soldering bumped work by partially penetrating the oxide film covering the solder bumpsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Jan 30, 2001·41 cites·6 claims
- 1068US6348234B1Paste applying methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Feb 19, 2002·13 cites·40 claims
- 1165US6605315B1Bonding paste applicator and method of using itMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Aug 12, 2003·14 cites·11 claims
- 1264US8148253B2Electronic component soldering structure and electronic component soldering methodOZONO MITSURU·Filed 2006·Granted Apr 3, 2012·4 cites·6 claims
- 1355US6617675B2Semiconductor device and semiconductor device assemblyMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Sep 9, 2003·6 cites·8 claims
- 1453US6852572B2Method of manufacturing semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Feb 8, 2005·5 cites·22 claims
- 1552US7446423B2Semiconductor device and method for assembling the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Nov 4, 2008·10 cites·19 claims
- 1644US6808086B2Paste ejection apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Oct 26, 2004·2 cites·11 claims
- 1742US6685777B2Paste applicator and paste application method for die bondingMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Feb 3, 2004·1 cites·10 claims
- 1841US2009000109A1Electronic Component Pickup Method, Electronic Component Mounting Method and Electronic Component Mounting ApparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Application pending·0 cites
- 1941US2009202333A1Electronic component pickup method, electronic component mounting method and electronic component mounting apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Application pending·0 cites
- 2034US6460756B2Method of applying bonding pasteMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Oct 8, 2002·0 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →