Inventor · disambiguated record
Kimiharu Kayukawa
Also filed as: KAYUKAWA KIMIHARU
8 granted patents·2 pending applications·58 citations·filing 2005–2012
83Inventor score
Top patents by PatentIndex Score
10 records- 0193US7470996B2Packaging methodDENSO CORP·Filed 2006·Granted Dec 30, 2008·32 cites·5 claims
- 0284US8156804B2Capacitive semiconductor sensorSAKAI MINEKAZU·Filed 2007·Granted Apr 17, 2012·14 cites·14 claims
- 0379US7420246B2Vertical type semiconductor device and method for manufacturing the sameDENSO CORP·Filed 2006·Granted Sep 2, 2008·7 cites·14 claims
- 0462US7361996B2Semiconductor device having tin-based solder layer and method for manufacturing the sameDENSO CORP·Filed 2005·Granted Apr 22, 2008·2 cites·12 claims
- 0556US7971349B2Bump bonding methodDENSO CORP·Filed 2009·Granted Jul 5, 2011·1 cites·9 claims
- 0654US7659127B2Manufacturing device of semiconductor package and manufacturing method of semiconductor packageDENSO CORP·Filed 2007·Granted Feb 9, 2010·2 cites·18 claims
- 0748US7579212B2Semiconductor device having tin-based solder layer and method for manufacturing the sameDENSO CORP·Filed 2007·Granted Aug 25, 2009·0 cites·16 claims
- 0838US2006081996A1Semiconductor device having aluminum electrode and metallic electrodeDENSO CORP·Filed 2005·Application pending·0 cites
- 0936US9009948B2Method of manufacturing stator coil for electric rotating machineKAYUKAWA KIMIHARU·Filed 2012·Granted Apr 21, 2015·0 cites·11 claims
- 1033US2011042812A1Electronic device and method of manufacturing the sameDENSO CORP·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →