Inventor · disambiguated record
Wilhelm Kegel
Also filed as: KEGEL WILHELM
6 granted patents·3 pending applications·126 citations·filing 2000–2016
79Inventor score
Files withINFINEON TECHNOLOGIES AG3CENTROTHERM INT AG1CENTROTHERM PHOTOVOLTAICS AG1CENTROTHERM THERMAL SOLUTIONS GMBH & CO KG1MATTSON THERMAL PRODUCTS GMBH1
Top patents by PatentIndex Score
9 records- 0193US6699747B2Method for increasing the capacitance in a storage trenchINFINEON TECHNOLOGIES AG·Filed 2002·Granted Mar 2, 2004·117 cites·14 claims
- 0253US9252011B2Method for forming a layer on a substrate at low temperaturesNIESS JUERGEN·Filed 2012·Granted Feb 2, 2016·1 cites·10 claims
- 0351US9711388B2Substrate holder and a device and a method for treating substratesCENTROTHERM THERMAL SOLUTIONS GMBH & CO KG·Filed 2013·Granted Jul 18, 2017·1 cites·18 claims
- 0449US7151060B2Device and method for thermally treating semiconductor wafersMATTSON THERMAL PRODUCTS GMBH·Filed 2003·Granted Dec 19, 2006·4 cites·34 claims
- 0544US6706616B1Method for improving thermal process stepsINFINEON TECHNOLOGIES AG·Filed 2000·Granted Mar 16, 2004·1 cites·13 claims
- 0641US2016217982A1Method and device for detecting a plasma ignitionCENTROTHERM PHOTOVOLTAICS AG·Filed 2014·Application pending·0 cites
- 0740US7094637B2Method for minimizing the vapor deposition of tungsten oxide during the selective side wall oxidation of tungsten-silicon gatesINFINEON TECHNOLOGIES AG·Filed 2003·Granted Aug 22, 2006·2 cites·21 claims
- 0837US2001030352A1Method for increasing the capacitance in a storage trench and trench capacitor having increased capacitanceFiled 2001·Application pending·0 cites
- 0934US2018366352A1Method and device for the thermal treatment of substrates and holding unit for substratesCENTROTHERM INT AG·Filed 2016·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Wilhelm Kegel files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →