Inventor · disambiguated record
Baik-Soon Choi
Also filed as: CHOI BAIK-SOON
22 granted patents·4 pending applications·748 citations·filing 1998–2018
96Inventor score
Top patents by PatentIndex Score
26 records- 0196US6213856B1Conditioner and conditioning disk for a CMP pad, and method of fabricating, reworking, and cleaning conditioning diskSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Apr 10, 2001·166 cites·26 claims
- 0296US6179955B1Dry etching apparatus for manufacturing semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Jan 30, 2001·344 cites·8 claims
- 0390US6216548B1Method for sampling particles present in a processing chamberSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Apr 17, 2001·44 cites·37 claims
- 0480US7387988B2Thinner composition and method of removing photoresist using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jun 17, 2008·4 cites·12 claims
- 0578US6432838B1Chemical vapor deposition apparatus for manufacturing semiconductor devices, its driving method, and method of optimizing recipe of cleaning process for process chamberSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Aug 13, 2002·14 cites·2 claims
- 0677US6251241B1Inductive-coupled plasma apparatus employing shield and method for manufacturing the shieldSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Jun 26, 2001·18 cites·19 claims
- 0776US6664119B2Chemical vapor deposition method for manufacturing semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Dec 16, 2003·12 cites·4 claims
- 0875US8227182B2Methods of forming a photosensitive filmLEE AHN-HO·Filed 2009·Granted Jul 24, 2012·5 cites·13 claims
- 0974US10894935B2Composition for removing silicone resins and method of thinning substrate by using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jan 19, 2021·2 cites·20 claims
- 1074US6279503B1Chemical vapor deposition apparatus for manufacturing semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Aug 28, 2001·31 cites·10 claims
- 1173US6146492APlasma process apparatus with in situ monitoring, monitoring method, and in situ residue cleaning methodSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Nov 14, 2000·41 cites·23 claims
- 1271US7863231B2Thinner composition and method of removing photoresist using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Jan 4, 2011·1 cites·6 claims
- 1368US6589719B1Photoresist stripper compositionsSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Jul 8, 2003·10 cites·22 claims
- 1465US6499492B1Plasma process apparatus with in situ monitoring, monitoring method, and in situ residue cleaningSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Dec 31, 2002·10 cites·17 claims
- 1561US6682876B2Thinner composition and method of stripping a photoresist using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jan 27, 2004·7 cites·21 claims
- 1652US6494927B2Conditioner and conditioning disk for a CMP pad, and method of fabricating, reworking, and cleaning conditioning diskSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Dec 17, 2002·3 cites·11 claims
- 1751US6119532AApparatus and method for particle sampling during semiconductor device manufacturingSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Sep 19, 2000·14 cites·15 claims
- 1850US6740169B2Method of reworking a conditioning diskSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted May 25, 2004·6 cites·11 claims
- 1949US6335284B1Metallization process for manufacturing semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Jan 1, 2002·16 cites·12 claims
- 2048US9840785B2Tin plating solution, tin plating equipment, and method for fabricating semiconductor device using the tin plating solutionSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Dec 12, 2017·0 cites·20 claims
- 2140US6585907B2Method for manufacturing a shield for an inductively-couple plasma apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Jul 1, 2003·0 cites·1 claims
- 2239US2006014391A1Method of manufacturing a semiconductor device using a cleaning compositionLEE KYUNG-JIN·Filed 2005·Application pending·0 cites
- 2339US2008026585A1Composition for removing a film, method of removing a film using the same, and method of forming a pattern using the sameKIM EUN-JEONG·Filed 2007·Application pending·0 cites
- 2435US2017158888A1Composition for removing silicone resins and method of thinning substrate by using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 2533US6596087B2Method of cleaning conditioning diskSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Jul 22, 2003·0 cites·7 claims
- 2633US2002061650A1Metallization process for manufacturing semiconductor devices and system used in sameFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →