Inventor · disambiguated record
Seung-Hyun Ahn
Also filed as: AHN SEUNG-HYUN
8 granted patents·3 pending applications·28 citations·filing 2002–2025
82Inventor score
Top patents by PatentIndex Score
11 records- 0180US7387988B2Thinner composition and method of removing photoresist using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jun 17, 2008·4 cites·12 claims
- 0275US8227182B2Methods of forming a photosensitive filmLEE AHN-HO·Filed 2009·Granted Jul 24, 2012·5 cites·13 claims
- 0371US7863231B2Thinner composition and method of removing photoresist using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Jan 4, 2011·1 cites·6 claims
- 0469US2025256486A1Composite laminateSK INNOVATION CO LTD·Filed 2025·Application pending·0 cites
- 0568US6589719B1Photoresist stripper compositionsSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Jul 8, 2003·10 cites·22 claims
- 0664US9885955B2Thinner compositionsSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Feb 6, 2018·1 cites·3 claims
- 0761US6682876B2Thinner composition and method of stripping a photoresist using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jan 27, 2004·7 cites·21 claims
- 0857US11421092B2Method for preparing unidirectionally aligned discontinuous fiber reinforcement composite material, unidirectionally aligned discontinuous fiber reinforcement composite material, and sandwich structureLG HAUSYS LTD·Filed 2018·Granted Aug 23, 2022·0 cites·4 claims
- 0940US10850454B2Porous single resin fiber composite material and method for manufacturing porous single resin fiber composite materialLG HAUSYS LTD·Filed 2016·Granted Dec 1, 2020·0 cites·10 claims
- 1039US2006014391A1Method of manufacturing a semiconductor device using a cleaning compositionLEE KYUNG-JIN·Filed 2005·Application pending·0 cites
- 1139US2008026585A1Composition for removing a film, method of removing a film using the same, and method of forming a pattern using the sameKIM EUN-JEONG·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →