Inventor · disambiguated record
Keisuke Nadamoto
Also filed as: NADAMOTO KEISUKE
5 granted patents·1 pending application·65 citations·filing 1998–2013
81Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0184US7629231B2Fabrication method of semiconductor deviceRENESAS TECH CORP·Filed 2007·Granted Dec 8, 2009·13 cites·8 claims
- 0283US8703583B2Fabrication method of semiconductor deviceMAKI HIROSHI·Filed 2009·Granted Apr 22, 2014·12 cites·21 claims
- 0368US6279226B1Lead bonding machine for bonding leads of a chip disposed over a carrier tape to an electrode pad formed on the chipHITACHI LTD·Filed 1998·Granted Aug 28, 2001·32 cites·3 claims
- 0455US6898848B2Method of bonding inner leads to chip padsRENESAS TECH CORP·Filed 2002·Granted May 31, 2005·6 cites·1 claims
- 0545US6516515B2Semiconductor integrated circuitHITACHI LTD·Filed 2001·Granted Feb 11, 2003·2 cites·4 claims
- 0639US2014265094A1Die bonder and bonding head device of the same, and also collet position adjusting methodHITACHI HIGH TECH INSTR CO LTD·Filed 2013·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →