Inventor · disambiguated record
Tatsuyuki Ohkubo
Also filed as: OHKUBO TATSUYUKI
4 granted patents·40 citations·filing 1998–2011
73Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0168US6279226B1Lead bonding machine for bonding leads of a chip disposed over a carrier tape to an electrode pad formed on the chipHITACHI LTD·Filed 1998·Granted Aug 28, 2001·32 cites·3 claims
- 0255US6898848B2Method of bonding inner leads to chip padsRENESAS TECH CORP·Filed 2002·Granted May 31, 2005·6 cites·1 claims
- 0345US6516515B2Semiconductor integrated circuitHITACHI LTD·Filed 2001·Granted Feb 11, 2003·2 cites·4 claims
- 0419US8965572B2Frame feeding system and frame feeding methodOHKUBO TATSUYUKI·Filed 2011·Granted Feb 24, 2015·0 cites·8 claims
Join the waitlist — get patent alerts
Get an alert when Tatsuyuki Ohkubo files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →