Inventor · disambiguated record
Ronald L. Hering
Also filed as: HERING RONALD L
10 granted patents·2 pending applications·147 citations·filing 1998–2008
90Inventor score
Top patents by PatentIndex Score
12 records- 0173US6332946B1Method for assembling a multi-layered ceramic packageIBM·Filed 1999·Granted Dec 25, 2001·41 cites·10 claims
- 0267US7086896B2Expandable standoff connector with slit collar and related methodIBM·Filed 2004·Granted Aug 8, 2006·12 cites·18 claims
- 0364US6444082B1Apparatus and method for removing a bonded lid from a substrateIBM·Filed 2000·Granted Sep 3, 2002·10 cites·29 claims
- 0462US6964885B2Stress resistant land grid array (LGA) module and method of forming the sameIBM·Filed 2004·Granted Nov 15, 2005·9 cites·33 claims
- 0559US7394666B2Circuit board cam-action standoff connectorIBM·Filed 2004·Granted Jul 1, 2008·6 cites·16 claims
- 0659US6112795AFixture for multi-layered ceramic package assemblyIBM·Filed 1998·Granted Sep 5, 2000·22 cites·20 claims
- 0758US6703560B2Stress resistant land grid array (LGA) module and method of forming the sameIBM·Filed 2001·Granted Mar 9, 2004·7 cites·7 claims
- 0856US7239516B2Flexure plate for maintaining contact between a cooling plate/heat sink and a microchipIBM·Filed 2004·Granted Jul 3, 2007·7 cites·21 claims
- 0956US6436223B1Process and apparatus for improved module assembly using shape memory alloy springsIBM·Filed 1999·Granted Aug 20, 2002·21 cites·18 claims
- 1053US2008232072A1Circuit board cam-action standoff connectorEDWARDS DAVID L·Filed 2008·Application pending·0 cites
- 1144US6049456AElectronic module adjustment design and process using shimsIBM·Filed 1998·Granted Apr 11, 2000·12 cites·45 claims
- 1239US2009098666A1Chip package assembly using chip heat to cure and verifyIBM·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →