Inventor · disambiguated record
Seiji Kogure
Also filed as: KOGURE SEIJI
4 granted patents·47 citations·filing 1991–2002
76Inventor score
Top patents by PatentIndex Score
4 records- 0158US6727718B2Electronic component package, printed circuit board, and method of inspecting the printed circuit boardFUJISTU LTD·Filed 2002·Granted Apr 27, 2004·7 cites·4 claims
- 0254US5182853AMethod for encapsulting IC chipFUJITSU LTD·Filed 1991·Granted Feb 2, 1993·25 cites·11 claims
- 0335US6498307B2Electronic component package, printing circuit board, and method of inspecting the printed circuit boardFUJITSU LTD·Filed 1998·Granted Dec 24, 2002·6 cites·3 claims
- 0434US5337467AMethod of producing wire-bonded substrate assemblyFUJITSU LTD·Filed 1991·Granted Aug 16, 1994·9 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →